ISO/IEC 14575:2000
Current
The latest, up-to-date edition.
Information technology Microprocessor systems Heterogeneous InterConnect (HIC) (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)
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English
20-07-2000
This International Standard applies to physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10 Mbit/s to 200 Mbit/s and at 1 Gbit/s in copper and optic technologies (as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)).
The object of this International Standard is to enable high-performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high-level protocols (communications, e.g. ATM, message passing, shared memory transactions, etc.), and to support links between heterogeneous systems.
DevelopmentNote |
Also numbered as IEEE 1355 (07/2001)
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DocumentType |
Standard
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Pages |
162
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PublisherName |
International Organization for Standardization
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Status |
Current
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Standards | Relationship |
NEN ISO/IEC 14575 : 2000 | Identical |
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IEC 60512-4:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests |
IEC 61076-4-101:2001 | Connectors for electronic equipment - Part 4-101: Printed board connectors with assessed quality - Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917 |
IEC 60512-9:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 9: Miscellaneous tests |
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IEC 61754-6:2013 | Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 6: Type MU connector family |
IEC 60512-5:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests |
IEC 60512-3:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests |
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