IPC TR 579 : 0
Current
Current
The latest, up-to-date edition.
ROUND ROBIN RELIABILITY EVALUATION OF SMALL DIAMETER PLATED-THROUGH HOLES IN PWBS
Available format(s)
Hardcopy
Language(s)
English
Published date
01-09-1988
Publisher
Approximately 200,000 PTHs covering primarily electroplated but also electroless technology were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated.
| DevelopmentNote |
Included in IPC C 105 & IPC C 1000. (08/2008)
|
| DocumentType |
Technical Report
|
| Pages |
42
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC A 39 : 1988 | SMALL HOLE RELIABILITY ROUND ROBIN ARTWORK |
| IPC TR 578 : 1984 | LEADING EDGE MANUFACTURING TECHNOLOGY REPORT |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC M 105 : LATEST | RIGID PRINTED BOARD MANUAL |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
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