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IPC-TM-650-MDP-A:2020

Current

Current

The latest, up-to-date edition.

IPC Test Method Development Packet

Available format(s)

Hardcopy

Language(s)

English

Published date

06-06-2012

This packet defines the elements that shall be included in an IPC-TM-650 Test Method and used to assist the IPC 7-11 Test Methods Subcommittee (TMSC) in their reviewing process.

DocumentType
Test Method
Pages
14
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

CEI EN IEC 61189-2-804:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

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