IPC PE 740 : 0

1.0 General Introduction
1.1 Purpose and Format
1.2 Guidelines for Effective Troubleshooting and
      Process Control
1.3 Applicable Documents
1.4 Handling
1.5 Baking
1.6 Rinsing
1.7 Packaging
1.8 Maintenance
2.0 Design and Documentation
2.1 Design
2.2 Layout Problems
2.3 Electrical
2.4 Material
2.5 Components
2.6 Assembly
2.7 Printed Board Fabrication
2.8 Board Physical Characteristics
2.9 Documentation
2.10 Inspection and Test
2.11 Reliability
3.0 Phototooling
3.1 Materials and Processes
3.2 Artwork
3.3 Production Master
3.4 Working Phototool, Production Master
4.1 General
4.2 Prepreg or 'B-Stage'
4.3 Laminate
4.4 Problems Associated with the Base Materials
5.0 Mechanical Operations
5.1 Drilling
5.2 Punching (Pierce and Blank)
5.3 Routing
5.4 Shearing
5.5 Beveling
5.6 Scoring
5.7 Laser Drilling
5.8 Water Jet Cutting/Profiling
6.0 Hole Preparation
6.1 Mechanical
6.2 Chemical Hole Preparation
6.3 Plasma Hole Preparation
6.4 Electrochemical Deburring
7.0 Electroless Processes
7.1 Hole Metallization (Conditioning) (includes Cleaner/
      Conditioner, Micro-Etch Solutions and Their Rinses)
7.2 Hole Catalyzation (Sensitizing) (includes Predip,
      Catalyst and Accelerator Baths and Their Rinses)
7.3 Hole Metallization (Copper Deposition) (includes
      Electroless Copper Bath and Rinses)
7.4 Hole Metallization (Rework)
7.5 Semi-Conductive Coatings
7.6 Full Build Electroless Copper
7.7 Direct Metallization During Drill Operation
8.0 Cleaning Procedures
8.1 Mechanical Cleaning Procedures
8.2 Chemical Cleaning Procedures
8.3 Electrocleaning
9.0 Imaging
9.1 General
9.2 Dry Film Photoresist
9.3 Liquid Photoresist
9.4 Screen Printed Resist
9.5 Electrophoretically Deposited Photoresist
9.6 Laser Imaging of Photoresist
10.1 Electroplating
10.1 General
10.2 Copper Electroplating
10.3 Tin-lead
10.4 Tin
10.5 Nickel
10.6 Gold Plating
10.7 Contact Plating (Tab or Finger Plating)
10.8 Miscellaneous Plating Solutions
11.0 Etching
11.1 General
11.2 Cupric Chloride
11.3 Alkaline (Ammoniacal) Etchants
11.4 Peroxide-Sulfuric Etchants
11.5 Ferric Chloride
11.6 Miscellaneous Etching Solutions
12.0 Innerlayer Fabrication
12.1 General
12.2 Print and Etch Innerlayers
12.3 Innerlayers with Blind and/or Buried Vias
12.4 Copper Treatment to Improve Laminate Adhesion
13.0 Lamination
13.1 General
13.2 Handling
13.3 Equipment
13.4 Material
13.5 Tooling
13.6 Multilayer Design
13.7 Innerlayer Preparation
13.8 Prepreg (B-Stage) Preparation
13.9 Copper Foil Preparation
13.10 Lay Up
13.11 Pressing
13.12 Post Lamination Bake
13.13 Subsequent Processing
14.0 Metallic Protective Coatings
14.1 Tin-lead Fusing
14.2 Solder Leveling
14.3 Immersion Coatings
14.4 Electroless Coatings
15.0 Non-metallic Protective Coatings
15.1 Permanent Solder Resist
15.2 Temporary Protective Coatings
15.3 Temporary Solder Resists
15.4 Nomenclature (Legend) - Non-metallic Materials
16.1 General
16.2 Component Preparation
16.3 Board Preparation
16.4 Component Insertion (Through-Hole)
16.5 Component Placement Surface Mount
16.6 Chip-on-Board (Unpackaged Chip Components)
17.1 General
17.2 Soldering Materials
17.3 Manual (Hand) Soldering
17.4 Wave Soldering
17.5 Vapor Phase Soldering
17.6 Infrared/Convection Reflow Soldering
18.1 Cleaning
19.0 Post Soldering Processes
19.1 Conformal Coating
19.2 Varnishing
19.3 Potting and Casting
20.0 Inspection and Test
20.1 Methods of Inspection and Test
20.2 Cleanliness
20.3 Electrical Testing
20.4 Visual and Automatic Optical Inspection
20.5 Thermal Stress (Solder Float)
20.6 Microsectioning
20.7 Other Test Methods
21.0 Modification, Rework and Repair
21.1 Terms and Definitions
21.2 Component Removal and Replacement
SECTION 1 GENERAL INFORMATION
1.0 General Introduction
1.1 Purpose and Format
1.2 Guidelines for Effective Troubleshooting and Process
      Control
      1.2.1 Problem Identification and Statement
      1.2.2 Immediate Action Plans
      1.2.3 Measurement System Evaluation
      1.2.4 Parameter Diagnostics
      1.2.5 Parameter Analysis
      1.2.6 Corrective Action Plan
1.3 Applicable Documents
      1.3.1 IPC
      1.3.2 Government
1.4 Handling
      1.4.1 Scratches
      1.4.2 Bending or Flexing Panels
      1.4.3 Fingerprints
      1.4.4 Storage
1.5 Baking
      1.5.1 General Problems Associated With Baking
      1.5.2 Resin Curing
      1.5.3 Stress Relief
      1.5.4 Moisture Removal
      1.5.5 Organic Coating Cure
1.6 Rinsing
      1.6.1 Rinse Time
      1.6.2 Rinse Water Temperature
      1.6.3 Agitation to Improve Rinsing
      1.6.4 Spray Rinsing
      1.6.5 Counterflow Rinsing
      1.6.6 Drip Times
      1.6.7 Special Rinse Techniques
      1.6.8 References
1.7 Packaging
1.8 Maintenance
      1.8.1 Process Maintenance
      1.8.2 Preventative Maintenance
      1.8.3 Corrective Maintenance
      1.8.4 Calibration Program
      1.8.5 Housekeeping
      1.8.6 Process Documentation and Procedures
Figures
1-1 Example of Counterflow Rinsing
Tables
1-1 Bake Times and Temperatures

Includes case histories of problems and corrective action in the design, manufacture, assembly and testing of printed wiring products. Each section has been updated to reflect today's manufacturing challenges. Sections address documentation, photo tooling, raw materials, mechanical operations, hole preparation, plated-through hole, cleaning procedures, imaging, electroplating, etching, inner layer fabrication lamination, soldering, metallic protective coatings, non-metallic protective coatings, component preparation and assembly, inspection and test, and rework and repair.