IPC PC 1990 : 1990
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
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GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
01-11-1999
23-11-2012
Section I
1.0 Scope
1.1 Scope
1.2 Purpose
1.3 Introduction
1.4 Interpretation
2.0 Applicable documents
2.1 IPC
2.2 Government documents
2.3 Other publications
3.0 Terms & definitions
4.0 Implementation - application issues
4.1 Overall quality system
4.2 SPC strategic plan
4.3 Management commitment
4.4 SPC management
4.5 Ongoing training
4.6 Economic considerations of quality
4.7 Projects
4.8 Problem solving
4.9 Supplier SPC implementation
4.10 Internal SPC evaluation and verification
5.0 Parameter identification
5.1 End product parameters
5.2 In-process product parameters
5.3 Process parameters
6.0 Measurement system evaluation
6.1 Measurement system objectives
6.2 Determine accuracy and discrimination
6.3 Determine repeatability and reproducibility (R&R)
6.4 Determine measurement system stability
7.0 Objectives for parameter capability assessment
(PCA)
7.1 Parameter capability objectives
7.2 Characterize the distribution
7.3 Identification of specification limits or
operating limits and target values
7.4 Determine parameter capability (short term/long
term)
7.5 Parameter capability analysis
7.6 Continual improvements
8.0 Parameter diagnostics
8.1 Purpose
8.2 Limitations
8.3 Tools and techniques
8.4 Audit criteria
8.5 References
9.0 Parameter analysis
9.1 Define test objectives
9.2 Select test variables
9.3 Establish test settings
9.4 Develop test plan
9.5 Establish sampling requirements
9.6 Conduct test
9.7 Analyze test data
9.8 Test confirmation
9.9 Technical and managerial decisions
10.0 Parameter control
10.1 Define control objectives
10.3 Data analysis
10.4 Continual improvements
Section II Summary of audit criteria
Summary of audit criteria
Section III Appendices
A Case study
B References
C SPC quality rating
D Tool matrix
E Glossary of symbols
F Example of parameter diagnosis
G Example of current quality conformance techniques
H Comment form
Describes the general requirements for the implementation of Statistical Process Control (SPC). It is intended for use by individuals in electronics and other industries that are involved in the planning, implementation and evaluation of an SPC system. Thus, it outlines SPC philosophy, implementation strategies, tools and techniques that may be implied in different sequences on the specific company, operation or variables under consideration in order to relate process control and capability to end-product requirements.
DocumentType |
Standard
|
PublisherName |
Institute of Printed Circuits
|
Status |
Withdrawn
|
SupersededBy |
BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
IPC QS 95 : 1993 | GENERAL REQUIREMENTS FOR IMPLEMENTATION OF ISO 9000 QUALITY SYSTEMS |
IEC PAS 62214:2001 | Generic performance specification for printed boards |
IEC PAS 62213:2001 | Specification and characterization methods for nonwoven para-aramid reinforcement |
IEC PAS 62212:2001 | Specification and characterization methods for nonwoven "E" glass mat |
IPC 6011 GERMAN : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
IPC FC 231 : C1992 AMD 1 1995 | FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING |
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