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IPC L 115 : B

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS

Superseded date

01-12-1997

Superseded by

IPC 4101 : D

Published date

12-01-2013

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Covers the requirements for high-temperature performance, metal-clad, fully-cured, laminated plastic sheets, to be used primarily for the fabrication of printed wiring boards for electrical and electronic circuits. Applies to sheets when the laminate is 0.79mm (0.031 inch) or greater in nominal overall thickness.

DocumentType
Standard
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

IPC L 108 : B SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS
IPC ML 950 : C1980 RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
IPC D 949 : 1987 RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
IPC CC 110 : A 1997 GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC FC 150 : E COPPER FOIL FOR PRINTED WIRING APPLICATIONS

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