IPC L 108 : B
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SPECIFICATION FOR THIN METAL CLAD BASE MATERIALS FOR MULTILAYER PRINTED BOARDS
01-03-1998
23-11-2012
Covers the requirement for high-temperature, fully-cured, metal-clad, thin laminated plastic sheets, to be used primarily for high-temperature multilayered and thin printed boards for electrical and electronic circuits. This specification applies to sheets when the base laminate does not exceed 0.79mm (0.031 inch) in nominal thickness. Recognizes that printed boards are subject to classifications by intended end-item usage. Thus, where applicable, for ordering purposes the multilayer printed board laminate material is specified.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| RC.AERO 54407 : 1981 | MATERIALS FOR SINGLE AND DOUBLE SIDED PRINTED CIRCUIT BOARDS |
| IPC ML 950 : C1980 | RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR, |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| IPC CC 110 : A 1997 | GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS |
| IPC L 115 : B | SPECIFICATION FOR RIGID METAL-CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC L 112 : A92 | SPECIFICATION FOR COMPOSITE METAL CLAD BASE MATERIALS FOR PRINTED BOARDS |
| IPC L 109 : B | SPECIFICATION FOR RESIN PREIMPREGNATED FABRIC (PREPREG) FOR MULTILAYER PRINTED BOARDS |
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