IPC J STD 026 : 0
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
04-02-2018
Deals with semiconductor flip chip design requirements, Gives information for applications using section semiconductor substrates, materials, assembly and test procedures equal to established methods, bumping, test and handling practices. Describes electrical, thermal, and mechanical chip design parameters and methods, in addition to reliability aspects associated with these conditions and processes. Applicable to all new designs, in addition to modifications of non-flip chip designs.
| DevelopmentNote |
Included in IPC C 106. (06/2008) Included in IPC C 1000. (08/2008) Jointly published by IPC & EIA. (01/2018)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
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| Status |
Withdrawn
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| BS EN 62258-1:2010 | Semiconductor die products Procurement and use |
| I.S. EN 62258-1:2010 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| IPC SM 784 : 0 | GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION |
| IPC J STD 013 : 0 | IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IPC J STD 027 : 0 | MECHANICAL OUTLINE STANDARD FOR FLIP CHIP AND CHIP SIZE CONFIGURATIONS |
| IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| CEI EN 62258-1 : 2011 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC SM 784 : 0 | GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION |
| IEC PAS 62084:1998 | Implementation of flip chip and chip scale technology |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IEC PAS 62085:1998 | Implementation of ball grid array and other high density technology |
| IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
| IPC WP 003 : 1993 | CHIP MOUNTING TECHNOLOGY (CMT) |
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