IPC J STD 001 : F
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
Available format(s)
Hardcopy
Superseded date
21-02-2019
Superseded by
Published date
28-08-2014
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.
1 GENERAL
2 APPLICABLE DOCUMENTS
3 MATERIALS, COMPONENTS AND EQUIPMENT REQUIREMENTS
4 GENERAL SOLDERING AND ASSEMBLY REQUIREMENTS
5 WIRES AND TERMINAL CONNECTIONS
6 THROUGH-HOLE MOUNTING AND TERMINATIONS
7 SURFACE MOUNTING OF COMPONENTS
8 CLEANING PROCESS REQUIREMENTS
9 PCB REQUIREMENTS
10 COATING, ENCAPSULATION AND STAKING (ADHESIVE)
11 WITNESS (TORQUE/ANTI-TAMPERING) STRIPE
12 PRODUCT ASSURANCE
13 REWORK AND REPAIR
Appendix A - Guidelines for Soldering Tools and Equipment
Appendix B - Minimum Electrical Clearance - Electrical
Conductor Spacing
APPENDIX C - J-STD-001 Guidance on Objective Evidence of
Material Compatibility
Specifies materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.
| Committee |
5-20
|
| DevelopmentNote |
Supersedes IPC S 815. Included in IPC C 103 & IPC C 1000. E2010 edition is still available in Swedish, Hungarian, Polish & Turkish Languages, See separate records. F2014 edition is still available in Chinese, German, French, Danish, Italian, Japanese, Romanian, Russian & Spanish Languages, See separate records. (05/2016) Also available in Hardcopy format. (01/2018)
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| DocumentType |
Standard
|
| Pages |
102
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| MIL-DTL-15514 Revision G:2016 | Telephone Equipment, Sound Powered Telephone Handset, Headset-Chest Set, and Headset - Chest Set, Noise Attenuating |
| I.S. EN 61188-5-2:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
| AWS SHB : 3 | SOLDERING HANDBOOK |
| SAE AS 12500 : 2018 | CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES |
| I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
| BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
| SAE AS 95234A : 2020 | CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| EN 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| MIL-STD-2088 Revision B:2007 | BOMB RACK UNIT (BRU), SINGLE STORE, AIRCRAFT |
| IPC J STD 002 CHINESE : C | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| IPC CA 821 : 0 | GENERAL REQUIREMENTS FOR THERMALLY CONDUCTIVE ADHESIVES |
| IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| MIL-DTL-29563 Revision B:2014 | Antenna System, Aims Shipboard, Electronically Steered OE-120/UPX |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| MIL-DTL-32291 Base Document:2008 | CARTRIDGE, IMPULSE, CCU-165/B |
| IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 9501 : 0 | PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS) |
| IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC LDFR0805-CD : 2005 | IPC/JEDEC 9TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES AUGUST 2005 |
| IPC SPVC-LAT1 : 2010 | ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA |
| MIL-PRF-71226 Base Document:1996 | ARMAMENTS AND MUNITIONS, STANDARD PROVISIONS, GENERAL SPECIFICATION FOR |
| IPC J STD 005 RUSSIAN : A | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC J STD 004 RUSSIAN : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
| IPC 2223 CHINESE : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC LDFR1006-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND" |
| IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC TA 722 : 1990 | TECHNOLOGY ASSESSMENT HANDBOOK ON SOLDERING |
| IPC 1601 GERMAN : - | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-DTL-13735 Revision H:2017 | Switches, Toggle: 28 Volt DC |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 7092 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS |
| IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC TP 1090 : 1996 | THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002 |
| IPC SM 780 : 0 | COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING |
| IPC QE 615 : 1993 | ELECTRONIC ASSEMBLY EVALUATION HANDBOOK |
| IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| MIL-PRF-32565 Revision A:2017 | BATTERY, RECHARGEABLE, SEALED, 6T LITHIUM-ION |
| IPC LDFR0806-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND" |
| IPC TA 723 : 1991 | TECHNOLOGY ASSESSMENT HANDBOOK ON SURFACE MOUNTING |
| IPC LDFR0605-CD : 2005 | IPC/SOLDERTEC 3RD INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONICS "TOWARDS IMPLEMENTATION OF THE ROHS DIRECTIVE" |
| IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC LDFR1005-CD : 2005 | IPC/JEDEC 11TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES |
| IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 9592 : B | REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES |
| IPC 7912 : A | END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES |
| IPC 9500 : 2003 | ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE |
| IPC 7526 : 2007 | STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| IPC 7530 HUNGARIAN : - | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING (REFLOW AND WAVE) PROCESSES |
| IPC LDFR1106-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND" |
| IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| MIL-DTL-32106 Base Document:2003 | INITIATORS, ELECTRICAL, FOR ROCKET MOTOR IGNITERS |
| IPC 9502 : 0 | PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS |
| IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| MIL-DTL-87104 Revision C:2014 | COAXIAL ASSEMBLIES, GENERAL SPECIFICATION FOR |
| MIL-DTL-7788 Revision H:2011 | PANELS, INFORMATION, INTEGRALLY ILLUMINATED |
| IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| IPC DVD PTH : LATEST | THROUGH-HOLE SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION |
| IPC LDFR0306-CD : 2006 | IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES |
| IPC SPVC2005-CD : 2005 | ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER |
| MIL-DTL-29183 Revision C:2003 | PANELBOARDS, POWER DISTRIBUTION, PORTABLE, WEATHERPROOF, GENERAL SPECIFICATION FOR |
| IPC FA 251 : 0 | GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS |
| IPC DPMO 202 : 2002 | IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET |
| IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
| MIL-DTL-917 Revision F:2014 | ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR |
| IPC LDFR1205-CD : 2006 | IPC/JEDEC 12TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES - DECEMBER 2005 |
| IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 5701 : 0 | USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
| IPC TR 583 : 0 | AN IN-DEPTH LOOK AT IONIC CLEANLINESS TESTING |
| IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
| IPC 2223 GERMAN : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE PRINTED BOARDS |
| IPC EM 782 : 1996 | SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD SPREADSHEET |
| IPC TR 467 : 0 | SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES) |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| MIL-DTL-32360 Base Document:2010 | STOP LIGHT - TAILLIGHT, VEHICULAR-24 VOLT, SERVICE STOP, SERVICE TAIL, BLACKOUT TAIL |
| IPC TA 724 : 1998 | TECHNOLOGY ASSESSMENT ON CLEANROOMS |
| IPC J STD 004 CHINESE : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC 9203 : 0 | USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE |
| IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC HDBK 005 : 0 | GUIDE TO SOLDER PASTE ASSESSMENT |
| IPC HDBK 610 : 0 | HANDBOOK AND GUIDE TO SUPPLEMENT IPC-A-610 (INCLUDES IPC-A-610 B-C-D COMPARISONS |
| IPC 7530 CHINESE : 2001 | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE) |
| IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC TR 460 : A1984 | TROUBLE-SHOOTING CHECKLIST FOR WAVE SOLDERING PRINTED WIRING BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
| IPC 7351 GERMAN : B | Basic requirements for SMT design and SMD patch guideline |
| IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC TP 1114 : 1998 | THE LAYMAN'S GUIDE TO QUALIFYING A PROCESS TO J-STD-001B |
| IPC 9261 : A | IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS |
| IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| IPC DVD SMT : LATEST | SURFACE MOUNT SOLDER JOINT WORKMANSHIP STANDARDS WITH TRAINING CERTIFICATION |
| IPC DW 426 : 0 | SPECIFICATIONS FOR ASSEMBLY OF DISCRETE WIRING |
| IPC LDFR0406-CD : 2006 | IPC/SOLDERTEC GLOBAL 4TH INTERNATIONAL ELECTRONICS CONFERENCE AND EXHIBITION "ROHS COMPLIANCE AND BEYOND" |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 005 CHINESE : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| MIL-DTL-5589 Revision E:1999 | EARPHONE, (EXTENDED RANGE), H-301/U |
| IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 9199 : 0 | STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING |
| IPC TP 1115 : 1998 | SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS |
| IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| SAE AS 95234 : 2014 | CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
| I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
| MIL-DTL-62741 Revision A:1998 | PRINTED WIRING ASSEMBLY, MUX/ADCON |
| MIL-DTL-62740 Revision A:1998 | PRINTED WIRING ASSEMBLY, SPECIAL CIRCUITS |
| MIL-DTL-5015 Revision H:2000 | CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE - GENERAL SPECIFICATION FOR |
| IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
| IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
| MIL-STD-186 Revision F:2002 | PROTECTIVE FINISHING SYSTEMS FOR ROCKETS, GUIDED MISSILES, SUPPORT EQUIPMENT AND RELATED MATERIALS |
| IPC 9202 : 0 | MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE |
| MIL-DTL-32015 Base Document:1999 | MICROPHONES, LINEAR, GENERAL SPECIFICATION FOR |
| MIL-DTL-22442 Revision G:2009 | CABLE ASSEMBLIES, AIRCRAFT AUDIO, GENERAL SPECIFICATION FOR |
| MIL-DTL-62736 Revision A:1998 | PRINTED WIRING ASSEMBLY, I/O |
| SAE AS 81703 : 2012 | CONNECTORS, ELECTRIC, CIRCULAR, MINIATURE, RACK AND PANEL OR PUSH-PULL COUPLING, ENVIRONMENT RESISTING |
| I.S. EN 61188-5-6:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES |
| ARINC 669 : 2004 | GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| IEEE 1662-2008 | IEEE Guide for the Design and Application of Power Electronics in Electrical Power Systems on Ships |
| BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
| NASA KSC E 165 : 2009 | ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR |
| NASA GSFC STD 6001 : 2016 | CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE |
| NASA STD 8739.6 : 2016 | IMPLEMENTATION REQUIREMENTS FOR NASA WORKMANSHIP STANDARDS |
| NASA STD 5005 : 2013 | STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
| MIL-DTL-53078 Revision A:2011 | MOUNTING KIT: M1 TANK CLEARED LANE MARKING SYSTEM (CLAMS) |
| NASA KSC DE 512-SM : 2012 | FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| NASA MSFC STD 3012 : 2012 | ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
| NASA KSC STD E 0010 : 1994 | SOLDERING OF ELECTRICAL CONNECTIONS (HAND OR MACHINE), STANDARD FOR |
| NASA JSC 20793 : 2017 | CREWED SPACE VEHICLE BATTERY SAFETY REQUIREMENTS |
| NASA GSFC STD 8002 : 2015 | STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX |
| NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
| NASA STD 8739.4 : 2016 | WORKMANSHIP STANDARD FOR CRIMPING, INTERCONNECTING CABLES, HARNESSES, AND WIRING |
| MIL-HDBK-454 Revision B:2007 | GENERAL GUIDELINES FOR ELECTRONIC EQUIPMENT |
| IPC HDBK 630 : 0 | GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IES RP 7 : 2017 | RECOMMENDED PRACTICE FOR LIGHTING INDUSTRIAL FACILITIES |
| SAE AS 81582 : 2017 | CONNECTORS, ELECTRICAL, BAYONET COUPLING, ENVIRONMENT RESISTING, UMBILICAL, GENERAL SPECIFICATION FOR |
| MIL-DTL-32086 Base Document:2004 | Intercom, Portable |
| SAE AS 50151 : 2015 | CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE, GENERAL SPECIFICATION FOR |
| NASA MSFC SPEC 3635 : 2012 | PYROTECHNIC SYSTEM SPECIFICATION |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/TS 62647-2:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin |
| BS EN 61188-5-6:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| AWS WHC2.13 : 0 | WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING |
| MIL-PRF-32070 Revision A:2012 | TEST PROGRAM SETS |
| MIL-STD-1568 Revision D:2015 | Materials and Processes for Corrosion Prevention and Control in Aerospace Weapons Systems |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| BS EN 61188-5-2:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| MIL-DTL-18714 Revision F:2012 | PRIMER, ELECTRIC, MARK 45 MOD 1 |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IPC 1601 CHINESE : 2016 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
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