IPC HDBK 610 : 0
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
HANDBOOK AND GUIDE TO SUPPLEMENT IPC-A-610 (INCLUDES IPC-A-610 B-C-D COMPARISONS
18-09-2023
01-10-2005
1 Acceptability of Electronic Assemblies
1.1 Scope
1.2 Purpose
1.3 Specialized Designs
1.4 Terms & Definitions
1.5 Examples and Illustrations
1.6 Inspection Methodology
1.7 Verification of Dimensions
1.8 Magnification Aids and Lighting
2 Applicable Documents
2.1 IPC Documents
2.2 Joint Industry Documents
2.3 EOS/ESD Association Documents
2.4 Electronics Industries Alliance Documents
2.5 International Electrotechnical Commission
Documents
2.6 Federal Standards
3 Handling Electronic Assemblies
3.1 Electrical Overstress (EOS) Damage
Prevention
3.2 Electrostatic Discharge (ESD) Damage
Prevention
3.3 EOS/ESD Safe Workstation/EPA
3.4 Handling
4 Mechanical Assembly
4.1 Hardware
4.2 Hardware Mounting
4.3 Swaged Hardware
4.4 Component Mounting
4.5 Connectors, Handles, Extractors
4.6 Heat Sink
4.7 Terminals - Edge Clip
4.8 Connector Pins
5 Component Installation Location/
Orientation
5.1 Orientation
5.2 Mounting
5.3 Lead Forming
5.4 Damage
5.5 Terminals
5.6 Insulation
5.7 Conductor
6 Soldering
6.1 Soldering Acceptability Requirements
6.2 Lead Protrusion
6.3 Plated-Through Holes (PTH) (Supported
Holes)
6.4 Unsupported Holes
6.5 Other
6.6 Terminals
6.7 Insulation
6.8 High Voltage
6.9 Connector Pins - Press-Fit Pins
6.10 Gold Fingers
7 Cleanliness
7.1 Flux Residues
7.2 Particulate Matter
7.3 Chlorides, Carbonates, and White Residues
7.4 Flux Residues - No Clean Process
Appearance
7.5 Surface Appearance
8 Marking
8.1 Etched Marking (including Hand Printing)
8.2 Screened Marking
8.3 Stamped Marking
8.4 Laser Marking
8.5 Labels
9 Coatings
9.1 Conformal Coating
9.2 Solder Resist Coating
10 Laminate Conditions
10.1 Introduction
10.2 Laminate Damage
10.3 Flexible and Rigid-Flex Printed Wiring
10.4 Solder Resist Discoloration
10.5 Burns
10.6 Bow and Twist
10.7 Conductor/Land Damage
11 Discrete Wiring
11.1 Solderless Wrap
11.2 Jumper Wires
12 Surface Mount Assemblies
12.1 Staking Adhesive
12.2 Solder Joints
12.3 Chip Component - Termination Variations
12.4 SMT Soldering Anomalies
Appendix A Electrical Conductor Spacing Appendix A
Appendix B Metric Conversion Information, Appendix H-1
Appendix C Comparison of IPC-A-610 Revision B to C
Appendix D U.S. Department of Defense Adoption
Notice
Provides IPC-A-610 change history and cross reference support along with the previous Rev B to C content. Also offers explanatory and tutorial information to help with the understanding the requirements of IPC-A-610.
| Committee |
7-30
|
| DevelopmentNote |
To be used in conjunction with IPC HDBK 001 and J STD 001. (06/2003) Also available in CD-ROM format. (09/2005) 2005 version incorporates Amendment 1 to 2002 version. (12/2005)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| IPC EA 100 K : 2001 | ELECTRONIC ASSEMBLY REFERENCE SET |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC E 500 : LATEST | IPC ELECTRONIC DOCUMENT COLLECTION |
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