IPC D 859 : 0
Current
Current
The latest, up-to-date edition.
DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS
Available format(s)
Hardcopy
Language(s)
English
Published date
01-12-1989
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.Covers the requirements for the design of multilayer hybrid circuits that are based in industry manufacturing capabilities.
| DocumentType |
Standard
|
| Pages |
44
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| ASME Y14.24 : 2012 | TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
| IPC TF 870 : 0 | QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS |
| IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
| IPC HM 860 : 0 | SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS |
| IPC DD 135 : 0 | QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES |
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