IPC CC 830 : B
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
18-09-2023
01-09-2008
1 SCOPE
1.1 Scope
1.2 Purpose
1.3 Classification
1.3.1 Types
1.3.2 Classes
1.4 Interpretation
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Government
2.3 American Society for Testing of Materials
2.4 Underwriters Laboratories
2.5 ANSI
2.6 ISO
3 REQUIREMENTS
3.1 General Requirements
3.1.1 Terms and Definitions
3.1.2 Conflict
3.2 Inspection and Testing Requirements
3.2.1 Qualification Inspection and Testing
3.2.2 Qualification Retention Inspection and Testing
3.2.3 Quality Conformance Inspection Testing
3.2.4 Additional Testing
3.3 Materials Requirements
3.3.1 Materials
3.3.2 Shelf Life
3.3.3 Cure
3.4 Chemical Requirements
3.4.1 Fourier Transform Infrared Spectroscopy Test (FTIR)
3.5 Physical Requirements
3.5.1 Viscosity
3.5.2 Appearance
3.5.3 Fluorescence
3.5.4 Fungus Resistance
3.5.5 Flexibility
3.5.6 Flammability
3.6 Electrical Requirements
3.6.1 Dielectric Withstanding Voltage (DWV)
3.7 Environmental Requirements
3.7.1 Moisture and Insulation Resistance
3.7.2 Thermal Shock
3.7.3 Temperature and Humidity Aging (Hydrolytic Stability)
3.8 Special Requirements
4 QUALITY ASSURANCE PROVISION
4.1 Responsibility for Inspection
4.2 Categories of Inspection and Frequency
4.2.1 Qualification Inspection
4.2.2 Qualification Retention Inspection
4.2.3 Quality Conformance Inspection
4.3 Product Change
4.4 Test Equipment and Inspection Facilities
4.4.1 Standard Laboratory Conditions
4.4.2 Permissible Temperature Variation in Environmental
Chambers
4.4.3 Reference Conditions
4.5 Inspection Routine
4.6 Inspection Sampling
4.6.1 Test Vehicles
4.6.2 Sample Size
4.6.3 Preparation Prior to Coating
4.6.4 Coating
4.7 Failures
4.8 Inspection Reporting
4.8.1 Qualification Reporting
4.8.2 Qualification Retention Reporting
4.8.3 Quality Conformance Reporting
5 PREPARATION FOR DELIVERY
5.1 Containers
5.2 Packaging
5.3 Marking
6 NOTES
6.1 Order Data
6.2 Formulation Change
6.3 Conditioning
6.4 Cleanliness
6.5 Adhesion
6.6 Solvent Compatibility
6.7 Identification of Solvent Sensitive Conformal Coatings
Appendix A - Example of Qualification Inspection Report
Appendix B - Example of Qualification Retention Inspection
Report
Appendix C - Example of Quality Conformance Inspection Report
Establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). Intends to obtain maximum confidence in the materials with minimum test redundancy. Covers: - The qualification and qualification retention of the conformal coating material. - The quality conformance of conformal coating material properties.
Committee |
5-30
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DevelopmentNote |
Included in IPC C 103 & IPC C 1000. B2002 Edition Re-Issued in October 2008 & incorporates AMD 1 2008. Also available in Chinese Language, See IPC CC 830 CHINESE. (07/2009) Also numbered as IEC PAS 61249-8-1. (06/2014)
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DocumentType |
Standard
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PublisherName |
Institute of Printed Circuits
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Status |
Superseded
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SupersededBy |
IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
IPC CC0201-CD : 2010 | CONFORMAL COATING APPLICATIONS, INSPECTION, REWORK & QUALITY CONTROL INTERACTIVE CD-ROM |
IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
MIL-C-28809 Revision B:1988 | CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-32484 Base Document:2013 | PROTECTIVE RELAYS AND ATTACHMENTS, MEDIUM VOLTAGE VACUUM CIRCUIT BREAKER APPLICATIONS |
IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-DTL-17361 Revision G:2006 | CIRCUIT BREAKER TYPES AQB/NQB, AIR, ELECTRIC, LOW VOLTAGE, INSULATED HOUSING (SHIPBOARD USE), GENERAL SPECIFICATION FOR |
IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
MIL-DTL-32485 Base Document:2013 | CIRCUIT BREAKERS, VACUUM TYPE (VCB), ELECTRIC POWER, MEDIUM VOLTAGE, ALTERNATING CURRENT, DRAW-OUT REMOVABLE CONSTRUCTION, WITHOUT INTERNAL OVERCURRENT PROTECTION |
IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
PD IEC/TS 62647-2:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin |
IEC PAS 62588:2008 | Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
SAE AS 12500 : 2018 | CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES |
MIL-DTL-24308-23 Revision G:2009 | CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, SOCKET CONTACTS PRINTED WIRING BOARD TERMINATION TYPES |
IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-32192 Base Document:2005 | RESISTOR, CHIP, THERMAL (THERMISTOR), GENERAL SPECIFICATION FOR |
PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC CC0509 : 2009 | CONFORMAL COATING PHOTO GUIDE ON CD |
IPC HDBK 630 : 0 | GUIDELINES FOR DESIGN, MANUFACTURE, INSPECTION AND TESTING OF ELECTRONIC ENCLOSURES ASSEMBLY |
IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-PRF-32159 Base Document:2004 | Resistor, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
MIL-PRF-31032-6 Revision B:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
IPC HDBK 850 : 0 | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF POTTING MATERIALS AND ENCAPSULATION PROCESSES USED FOR ELECTRONICS PRINTED CIRCUIT BOARD ASSEMBLY |
IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
MIL-DTL-32483 Base Document:2013 | Switchgear, Power, Hard-Mounted, Medium Voltage, Naval Shipboard |
MIL-DTL-24308-24 Revision H:2009 | CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, PIN CONTACTS PRINTED WIRING BOARD TERMINATION TYPES |
IEC PAS 62647-2:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin |
IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
IPC P-CC0509 : 2009 | CONFORMAL COATING PHOTOGRAPHIC POSTER GUIDE |
IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
MIL-PRF-55342 Revision H:2003 | RESISTOR, CHIP, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR |
IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 609 CHINESE : A | IPC/JEDEC MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IEC PAS 62293:2001 | Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) |
IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
DD IEC/PAS 62588:2008 | Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes |
IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
12/30262664 DC : DRAFT APR 2012 | BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
IPC TM 650 : 0 | TEST METHODS MANUAL |
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