IPC 9703 : 0

1 SCOPE
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 American Society for Testing and Materials
3 TERMS AND DEFINITIONS
4 USE CONDITIONS OVERVIEW
  4.1 Scope and Application of UCs
  4.2 Capturing UC Data
  4.3 Methods for Developing UCs
      4.3.1 Approach 1 - UC Derivation Approach
      4.3.2 Approach 2 - Leveraging Existing Data to
            Usage Model
      4.3.3 Torture Tests
5 SYSTEM TESTS
  5.1 Shock Test Equipment
      5.1.1 Drop Testers
      5.1.2 Shock Machines
      5.1.3 Inclined Impact
      5.1.4 Fixturing
  5.2 Correlation Criteria
      5.2.1 Unpackaged System Input Correlated to
            Packaged System Environment
      5.2.2 Unpackaged System Input Correlated to
            End User Use-Conditions
  5.3 Test Recommendations
      5.3.1 Testing Sample Recommendations
  5.4 Test Flow
      5.4.1 Packaged System Testing
      5.4.2 Unpackaged System Testing
  5.5 Post Test Analysis
  5.6 Testing Output and Report Recommendations
      5.6.1 General Considerations
      5.6.2 Electrical Testing
      5.6.3 Failure Analysis Considerations
      5.6.4 Reporting Recommendations for Test
            Development
6 SYSTEM BOARD LEVEL TESTING
  6.1 Board Testing Background
  6.2 System Board Testing Recommendations
  6.3 Correlation Criteria and Validity of Test Setup
  6.4 Equipment Recommendations
  6.5 Test Flows
  6.6 Failure Analysis
  6.7 Reporting Recommendations
7 COMPONENT MECHANICAL SHOCK ASSESSMENT
  7.1 Component Assessment - General Considerations
  7.2 Component Board Testing Recommendations
  7.3 Correlation Criteria and Validity of Test Setup
  7.4 Equipment Recommendations
  7.5 Testing Flows
      7.5.1 Characterization Testing
      7.5.2 Qualification Testing
  7.6 Failure Analysis
  7.7 Reporting Recommendations
8 METRICS FOR MATCHING TEST
      8.1.1 Acceleration Based Method
      8.1.2 Board Strain Based Method
Annex A - Sample Data Reporting Format
Annex B - Metrologies
Annex C - Shock Failure Analysis of Electronic Components
Annex D - Suggestions for Selecting Sample Size
Annex E - Suggestions for Finite Element Analysis in
          Mechanical Shock

Describes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. Also addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests.