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IPC 9701 : A

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS

Available format(s)

Hardcopy

Superseded date

04-06-2022

Superseded by

IPC-9701B:2022

Language(s)

English

$218.53
Including GST where applicable

1 SCOPE
  1.1 Purpose
  1.2 Performance Classification
  1.3 Definition of Terms
2 APPLICABLE DOCUMENTS
  2.1 IPC
  2.2 Joint Industry Standards
  2.3 International Tin Research Institute
  2.4 Other Publications
      2.4.1 Electronic Industries Association
      2.4.2 OEM Working Group
3 TERMS, DEFINITIONS AND CONCEPTS
  3.1 General
  3.2 Reliability Concepts
      3.2.1 Reliability Definition
  3.3 Physics-of-Failure Concepts
      3.3.1 Creep
      3.3.2 Stress Relaxation
      3.3.3 Solder Creep-Fatigue Model
      3.3.4 Differential Thermal Expansion
  3.4 Test Parameters
      3.4.1 Working Zone
      3.4.2 Cyclic Temperature Range/Swing
      3.4.3 Sample Temperature: Ts
      3.4.4 Maximum Sample Temperature: Ts (max)
      3.4.5 Maximum Nominal Temperature: T (max)
      3.4.6 Minimum Sample Temperature: Ts (min)
      3.4.7 Minimum Nominal Temperature: T (min)
      3.4.8 Mean Cyclic Temperature, T[SJ]
      3.4.9 Nominal delta T
      3.4.10 Dwell/Soak Time, t[D]
      3.4.11 Dwell/Soak Temperature
      3.4.12 Cycle Time
      3.4.13 Temperature Ramp Rate
      3.4.14 Maximum Cyclic Strain Range
      3.4.15 Maximum Cyclic Stress Range
      3.4.16 Hysteresis Loop
      3.4.17 Design Service Life
      3.4.18 Projected Service Life Service
      3.4.19 Infant Mortality Failures
      3.4.20 Random Steady-State Failures
      3.4.21 Wearout Failures
  3.5 Statistical Failure Distribution Concepts
      3.5.1 Statistical Failure Distribution
      3.5.2 Mean Fatigue Life, N(50%)
      3.5.3 Failure Free Life, N[0]
      3.5.4 Cumulative Failure Percentage
      3.5.5 Cumulative Failure Probability
      3.5.6 Acceptable Cumulative Failure Probability
  3.6 Reliability Tests
      3.6.1 Accelerated Reliability Test
      3.6.2 Thermal Cycling
      3.6.3 Thermal Shock
      3.6.4 Power Cycling
  3.7 Other Tests
      3.7.1 Burn-In Test
      3.7.2 Environmental Stress Screening (ESS)
      3.7.3 Highly Accelerated Stress Testing (HAST)
      3.7.4 Mechanical Shock
      3.7.5 Vibration
      3.7.6 Process Qualification
      3.7.7 Process Verification
  3.8 Evaluation and Application Considerations
  3.9 Understanding of Solder Attachment Technology
4 PERFORMANCE TEST METHODS
  4.1 General Requirements
  4.2 Test Vehicles
      4.2.1 Component Description
      4.2.2 Printed Wiring (Circuit) Boards
      4.2.3 Board Assembly
  4.3 Accelerated Temperature Test Methods
      4.3.1 Preconditioning by Isothermal Aging
      4.3.2 Temperature Cycling
      4.3.3 Test Monitoring
5 QUALIFICATION REQUIREMENTS
  5.1 Thermal Cycling Ranges
  5.2 Thermal Cycling Test Durations
  5.3 Number of Samples
  5.4 Test Exemption Requirements
6 FAILURE ANALYSIS
  6.1 Failure Analysis Procedures
  6.2 Failure Analysis Documentation
      Requirements
7 QUALITY ASSURANCE
  7.1 Responsibility for Inspection
  7.2 Quality Conformance Inspection
      7.2.1 As Assembled Inspection
      7.2.2 Thermal Cycling Inspection
      7.2.3 Failure Analysis Inspection
APPENDIX A
APPENDIX B
Figures
Tables

Establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies.

DevelopmentNote
To be used with IPC SM 785 (07/2002) Included in IPC C 103 & IPC C 1000. (07/2008) Also available in Chinese Language, See IPC 9701 CHINESE. (10/2010)
DocumentType
Standard
Pages
36
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy

IPC 9704 CHINESE : - PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE
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IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 9501 : 0 PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
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IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IEC TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
DD IEC PAS 62050 : DRAFT 2004 BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
NASA GSFC STD 6001 : 2016 CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
GEIA STD 0005-3 : 2013 PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES
IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
IPC 9707 : 0 SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
IPC 9702 CHINESE : - MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
PD IEC/TS 62647-3:2014 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes
DD IEC PAS 62647-3 : DRAFT SEP 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE
IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE
IPC 9501 : 0 PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
IPC 9504 : 0 ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)
IPC 9502 : 0 PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 9702 : 0 MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS
IPC M 103 : LATEST STANDARDS FOR SURFACE MOUNT ASSEMBLIES MANUAL
IPC SM 785 : 0 GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS
IPC 9500 : 2003 ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE

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