IPC 9701 : A
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
Hardcopy
04-06-2022
English
1 SCOPE
1.1 Purpose
1.2 Performance Classification
1.3 Definition of Terms
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
2.3 International Tin Research Institute
2.4 Other Publications
2.4.1 Electronic Industries Association
2.4.2 OEM Working Group
3 TERMS, DEFINITIONS AND CONCEPTS
3.1 General
3.2 Reliability Concepts
3.2.1 Reliability Definition
3.3 Physics-of-Failure Concepts
3.3.1 Creep
3.3.2 Stress Relaxation
3.3.3 Solder Creep-Fatigue Model
3.3.4 Differential Thermal Expansion
3.4 Test Parameters
3.4.1 Working Zone
3.4.2 Cyclic Temperature Range/Swing
3.4.3 Sample Temperature: Ts
3.4.4 Maximum Sample Temperature: Ts (max)
3.4.5 Maximum Nominal Temperature: T (max)
3.4.6 Minimum Sample Temperature: Ts (min)
3.4.7 Minimum Nominal Temperature: T (min)
3.4.8 Mean Cyclic Temperature, T[SJ]
3.4.9 Nominal delta T
3.4.10 Dwell/Soak Time, t[D]
3.4.11 Dwell/Soak Temperature
3.4.12 Cycle Time
3.4.13 Temperature Ramp Rate
3.4.14 Maximum Cyclic Strain Range
3.4.15 Maximum Cyclic Stress Range
3.4.16 Hysteresis Loop
3.4.17 Design Service Life
3.4.18 Projected Service Life Service
3.4.19 Infant Mortality Failures
3.4.20 Random Steady-State Failures
3.4.21 Wearout Failures
3.5 Statistical Failure Distribution Concepts
3.5.1 Statistical Failure Distribution
3.5.2 Mean Fatigue Life, N(50%)
3.5.3 Failure Free Life, N[0]
3.5.4 Cumulative Failure Percentage
3.5.5 Cumulative Failure Probability
3.5.6 Acceptable Cumulative Failure Probability
3.6 Reliability Tests
3.6.1 Accelerated Reliability Test
3.6.2 Thermal Cycling
3.6.3 Thermal Shock
3.6.4 Power Cycling
3.7 Other Tests
3.7.1 Burn-In Test
3.7.2 Environmental Stress Screening (ESS)
3.7.3 Highly Accelerated Stress Testing (HAST)
3.7.4 Mechanical Shock
3.7.5 Vibration
3.7.6 Process Qualification
3.7.7 Process Verification
3.8 Evaluation and Application Considerations
3.9 Understanding of Solder Attachment Technology
4 PERFORMANCE TEST METHODS
4.1 General Requirements
4.2 Test Vehicles
4.2.1 Component Description
4.2.2 Printed Wiring (Circuit) Boards
4.2.3 Board Assembly
4.3 Accelerated Temperature Test Methods
4.3.1 Preconditioning by Isothermal Aging
4.3.2 Temperature Cycling
4.3.3 Test Monitoring
5 QUALIFICATION REQUIREMENTS
5.1 Thermal Cycling Ranges
5.2 Thermal Cycling Test Durations
5.3 Number of Samples
5.4 Test Exemption Requirements
6 FAILURE ANALYSIS
6.1 Failure Analysis Procedures
6.2 Failure Analysis Documentation
Requirements
7 QUALITY ASSURANCE
7.1 Responsibility for Inspection
7.2 Quality Conformance Inspection
7.2.1 As Assembled Inspection
7.2.2 Thermal Cycling Inspection
7.2.3 Failure Analysis Inspection
APPENDIX A
APPENDIX B
Figures
Tables
Establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies.
DevelopmentNote |
To be used with IPC SM 785 (07/2002) Included in IPC C 103 & IPC C 1000. (07/2008) Also available in Chinese Language, See IPC 9701 CHINESE. (10/2010)
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DocumentType |
Standard
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Pages |
36
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PublisherName |
Institute of Printed Circuits
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Status |
Superseded
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SupersededBy |
IPC 9704 CHINESE : - | PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE |
IEC PAS 62050:2004 | Board level drop test method of components for handheld electronic products |
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IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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IEC TS 62647-3:2014 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
DD IEC PAS 62050 : DRAFT 2004 | BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS |
IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
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IEC PAS 62647-3:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
NASA GSFC STD 6001 : 2016 | CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE |
GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
GEIA STD 0005-3 : 2013 | PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES |
IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
IPC 9707 : 0 | SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
IPC 9702 CHINESE : - | MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS |
IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
PD IEC/TS 62647-3:2014 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes |
DD IEC PAS 62647-3 : DRAFT SEP 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
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PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
IPC 9704 : A | PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE |
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IPC 9702 : 0 | MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS |
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IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
IPC 9500 : 2003 | ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE |
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