IPC 9241 : 2016
Current
Current
The latest, up-to-date edition.
GUIDELINES FOR MICROSECTION PREPARATION
Published date
01-12-2016
Publisher
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1 SCOPE
2 APPLICABLE DOCUMENTS
3 SAMPLE REMOVAL PROCESS
4 MOUNT PROCESS
5 GRIND PROCESS
6 POLISH PROCESS
7 MICRO-ETCHING
8 TROUBLESHOOT GUIDE
9 GLOSSARY
10 REFERENCES
11 RECOMMENDED READING
Describes the many variables and problems associated with the process from sample removal to micro-etch.
| DevelopmentNote |
Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
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