IPC 9203 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE
Hardcopy
22-01-2024
English
FOREWORD
1 INTRODUCTION
2 APPLICABLE DOCUMENTS
3 THE IPC B-52 TEST VEHICLE
4 A WALK THROUGH OF IPC-9202
5 OTHER USEFUL INFORMATION
6 FINAL THOUGHTS
Addresses the IPC-B-52 standard test vehicle which can be used to evaluate optimize a manufacturing process or to provide objective evidence that a chosen manufacturing material set and manufacturing process are compatible from a cleanliness standpoint.
| DevelopmentNote |
Included in IPC C 103. (04/2013) Included in IPC C 108 & IPC C 1000. (07/2013) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| NASA GSFC STD 8002 : 2015 | STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC A 52-G : 2006 | CLEANLINESS AND RESIDUE EVALUATION TEST BOARD |
| DEFSTAN 00-10/3(1986) : 1986 AMD 2 1993 | GENERAL DESIGN AND MANUFACTURING REQUIREMENTS FOR SERVICE ELECTRONIC EQUIPMENT |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC A 24 : LATEST | SURFACE INSULATION RESISTANCE |
| IPC 9201 : A | SURFACE INSULATION RESISTANCE HANDBOOK |
| IPC TR 467 : 0 | SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES) |
| IPC 9202 : 0 | MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE |
| IPC 5704 : 0 | CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS |
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