IPC 7092 : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
Hardcopy
28-01-2018
English
1 SCOPE
2 APPLICABLE DOCUMENTS
3 GENERAL DESCRIPTION
4 COMPONENT CONSIDERATIONS
5 MATERIALS
6 EMBEDDED COMPONENT PROCESS
CHARACTERISTICS
7 MOUNTING BASE OR BOARD STACKUP
CONSIDERATIONS
8 DESIGN METHODOLOGY
9 TESTING AND VERIFICATION
10 POST ASSEMBLY CHARACTERISTICS
11 SUPPLIER SELECTIONS
APPENDIX A - Embedded Component History
APPENDIX B - Embedded Component Test
Coupons
Specifies the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board.
| DevelopmentNote |
Included in IPC C 103 & IPC C 1000. (05/2016) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
148
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| ISO/IEC 17025:2005 | General requirements for the competence of testing and calibration laboratories |
| IPC D 356 : B | BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT |
| IPC SM 784 : 0 | GUIDELINES FOR CHIP-ON-BOARD TECHNOLOGY IMPLEMENTATION |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC 9252 : A | REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 4563 : 0 | RESIN COATED COPPER FOIL FOR PRINTED BOARDS GUIDELINE |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC 4811 : 0 | SPECIFICATION FOR EMBEDDED PASSIVE DEVICE RESISTOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC 9151 : D | PRINTED BOARD PROCESS CAPABILITY, QUALITY, AND RELATIVE RELIABILITY (PCQR[2]) BENCHMARK TEST STANDARD AND DATABASE |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| IEC 61000-4-2:2008 | Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test |
| IPC 7094 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
| IPC 4821 : 0 | SPECIFICATION FOR EMBEDDED PASSIVE DEVICE CAPACITOR MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC QL 653 : A | Certification of Facilities that Inspect/Test Printed Boards, Components & Materials |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| ASME Y14.100 : 2017 | ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
| IPC 2316 : 0 | DESIGN GUIDE FOR EMBEDDED PASSIVE DEVICE PRINTED BOARDS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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