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IPC 6013 : C

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS

Available format(s)

Hardcopy

Superseded date

13-12-2021

Superseded by

IPC-6013D:2017

Language(s)

English

$392.85
Including GST where applicable

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 NOTES
APPENDIX A

Includes qualification and performance requirements of flexible printed boards.

Committee
D-10
DevelopmentNote
Supersedes IPC RF 245, IPC FC 250 & IPC ML 990. (07/2008) Supersedes IPC 6013 CHINESE & IPC 6013 GERMAN. (09/2017) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
72
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
IEC PAS 62249:2001 Identical

IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
NASA KSC DE 512-SM : 2012 FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
PD IEC/PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
NASA STD 5005 : 2013 STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
EN 50155:2017 Railway applications - Rolling stock - Electronic equipment
16/30282633 DC : 0 BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
BS EN 50155:2017 Railway applications. Rolling stock. Electronic equipment
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 4554 CHINESE : - SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 RUSSIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 4553 : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC 6202 : 0 IPC/JPCA PERFORMANCE GUIDE MANUAL FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS
IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
IPC DR 572 : A DRILLING GUIDELINES FOR PRINTED BOARDS
IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC FLXCSP0605-CD : 2005 IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION
IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC FLXCSP0706-CD : 2006 IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING
IPC SM 840 CHINESE : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
IPC 4553 CHINESE : A SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
IPC HDBK 840 : 0 SOLDER MASK HANDBOOK
IPC 4556 : 0 SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC 4554 : 0 SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
I.S. EN 61189-5-1:2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
13/30295427 DC : 0 BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
IEC PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

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