IPC 5702 : 0
Current
The latest, up-to-date edition.
GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS
Hardcopy
English
01-06-2007
1 SCOPE
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
2.3 Telcordia
2.4 Radio Technical Commission for Aeronautics
3 THE PROBLEM WITH UNDERSTANDING CLEANLINESS DATA
3.1 Where to Start
4 LAB TESTS
5 ENVIRONMENTAL STRESS SCREENING (ESS) TESTING
6 SUGGESTED APPROACH
7 SUMMARY
Appendix A - ROSE TESTING
Covers many aspects of how cleanliness is measured on printed boards, as well as many critical factors to consider when specifying board cleanliness in purchasing documents.
| Committee |
5-30
|
| DevelopmentNote |
Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC A 52-G : 2006 | CLEANLINESS AND RESIDUE EVALUATION TEST BOARD |
| IPC HDBK 830 : A | GUIDELINES FOR DESIGN, SELECTION AND APPLICATION OF CONFORMAL COATINGS |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| MIL-STD-810 Revision G:2008 | ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| IPC TR 476 : A1997 | ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES |
| IPC 9691 : A | USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING |
| IPC TR 583 : 0 | AN IN-DEPTH LOOK AT IONIC CLEANLINESS TESTING |
| IPC 9201 : A | SURFACE INSULATION RESISTANCE HANDBOOK |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC 5701 : 0 | USERS GUIDE FOR CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
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