IPC 4553 : A
Current
The latest, up-to-date edition.
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
Hardcopy
English
16-06-2009
Important note : All end users must be registered with an Account prior to user licenses being assigned.
1 SCOPE
1.1 Statement of Scope
1.2 Description
1.3 Objective
1.4 Performance Functions
1.4.1 Solderability
1.4.2 Contact Surface
1.4.2.1 Membrane Switches
1.4.2.2 Metallic Dome Contacts
1.4.3 EMI Shielding
1.4.4 Aluminum Wire Bonding
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Mil-Standards
2.3 Telcordia[TM]
3 REQUIREMENTS
3.1 Visual
3.2 Finish Thickness
3.2.1 Immersion Silver (IAg) Thickness
3.3 Porosity
3.4 Adhesion
3.5 Solderability
3.6 Cleanliness
3.7 Electrolytic Corrosion Testing
3.8 Packing and Storage
3.9 Chemical Resistance
3.10 High Frequency Signal Loss
3.11 Microvoids
4 QUALITY ASSURANCE PROVISIONS
4.1 Qualification
4.1.1 Sample Test Coupons
4.2 Acceptance Tests
4.3 Quality Conformance Testing
APPENDIX 1 - Chemical Definitions
APPENDIX 2 - Process Sequence (Generic)
APPENDIX 3 - Qualification of IAg Process by the Board
Supplier
APPENDIX 4 - Standard Developments Efforts of Immersion Silver
APPENDIX 5 - X-Ray Fluorescence (XRF) Spectroscopy
APPENDIX 6 - ROUND ROBIN TESTING
Specifies requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards.
| DevelopmentNote |
Included in IPC C 105 & IPC C 1000. (06/2009) Also available in Chinese Language, See IPC 4553 CHINESE. (11/2013)
|
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC TR 585 : 0 | TIME, TEMPERATURE AND HUMIDITY STRESS OF FINAL BOARD FINISH SOLDERABILITY |
| IPC 1601 GERMAN : - | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| IPC 1601 CHINESE : 2016 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC 4552 : 0 | PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC 6018 : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6013 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IPC 6016 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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