IPC 4103 : A
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
Hardcopy
11-03-2018
1 GENERAL
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 QUALITY ASSURANCE PROVISIONS
5 PREPARATION FOR DELIVERY
6 NOTES
Provides the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits.
| DevelopmentNote |
Supersedes IPC L 125. (12/2001) Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008) Included in IPC C 105. (12/2011) Also available in Hardcopy format. (03/2018)
|
| DocumentType |
Standard
|
| Pages |
96
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| IPC 2222 FRENCH : A2010 | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2252 : 0 | DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2141 : A:2004 | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IPC 2222 CHINESE : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| IPC 2222 GERMAN : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| PD IEC/PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
| IPC 2251 : 0 | DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IPC D 317 : A1995 | DESIGN GUIDELINES FOR ELECTRONIC PACKAGING UTILIZING HIGH SPEED TECHNIQUES |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
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