IPC 2583 : 2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
Hardcopy
15-06-2022
English
19-02-2021
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1 SCOPE
1.1 Intent
1.2 Interpretation
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
3.1 Terms and Definitions
3.2 Categories and Content
4 GENERAL RULES
4.1 Documentation
4.2 Content Element
4.3 LogisticHeader Elements
4.4 History Record Elements
4.5 Documentation Layers
4.5.1 CadHeader
4.5.2 CadData
4.5.3 Step/LayerFeature
4.5.4 Step/Datum
4.5.5 Step/Profile
4.5.6 Step/Package
4.5.7 Step/Component
4.6 Miscellaneous Step Descriptions
4.6.1 CadHeader
4.6.2 CadData
4.6.3 Step/LayerFeature
4.7 Design for eXcellence Elements
4.7.1 DfxMeasurementList
5 MODELING
6 DOCUMENTATION EXAMPLES
7 REFERENCE INFORMATION
7.1 IPC
7.2 American National Standards Institute
7.3 Department of Defense
7.4 Electronic Industries Association
7.5 International Electrotechnical Commission (IEC)
7.6 International Organization for Standards (ISO)
APPENDIX A - DRAWING METHOD SCHEMA
Describes the XML schema that represents the intelligent data file format used to describe design characteristics for manufacturing data description.
| DevelopmentNote |
IPC 2581 is a mandatory part of this standard. (08/2007)
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| DocumentType |
Standard
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| Pages |
0
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| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy |
| BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
| I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
| EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| IPC 2584 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION |
| IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
| ANSI Y14.5 : 1973 | DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
| IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
| IPC 2611 : 0 | GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION |
| DOD STD 100 : C NOTICE 6 | ENGINEERING DRAWING PRACTICES |
| IPC D 325 : A | DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
| IPC 2614 : 0 | SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION |
| ANSI Z210.1 : LATEST | METRIC PRACTICE GUIDE |
| ANSI INCITS TR 1 : 1982 | DICTIONARY FOR INFORMATION PROCESSING - AMERICAN NATIONAL |
| IPC 2615 : 0 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC D 310 : C | GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
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