IPC 2251 : 0
Current
The latest, up-to-date edition.
DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
Hardcopy
English
01-11-2003
1 General
1.1 Purpose
1.2 Scope
1.3 Symbology, Terms and Definitions
1.4 Units
2 Applicable Documents
3 Overview
3.1 Decision Making Process
3.2 Design Options
3.3 Mechanical Requirements
3.4 Electrical Considerations
4 Mechanical Considerations
4.1 Printed Board
4.2 Component Materials
4.3 Thermal Considerations
4.4 Component Placement
5 Electrical Considerations
5.1 Power Distribution
5.2 Permittivity
5.3 Lumped Capacitance Versus Transmission Line Environment
5.4 Propagation Delay Time
5.5 Impedance Models
5.6 Loading Effects
5.7 Crosstalk
5.8 Signal Attenuation
5.9 Computer Simulation Program
5.10 Connectors
5.11 EMI Layout Considerations
6 Performance Testing
6.1 Impedance Testing
6.2 Impedance Test Structures and Test Coupons
6.3 Stripline Impedance Test Coupon
Appendix A
Appendix B
Appendix C
Appendix D
Figures
Tables
Provides guidelines for the design of high-speed circuitry. Intended to be used by circuit designers, packaging engineers, circuit board fabrication, and procurements personnel.
| Committee |
D-20
|
| DevelopmentNote |
Supersedes IPC D 317 (01/2004) Included in IPC C 106, IPC C 105 & IPC C 1000. (07/2008)
|
| DocumentType |
Guide
|
| Pages |
49
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 2221 GERMAN : B | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| MIL-PRF-31032-6 Revision B:2017 | PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| MIL-PRF-31032-5 Revision B:2017 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 2141 : A | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| BS EN 16602-70-12:2016 | Space product assurance. Design rules for printed circuit boards |
| EN 16602-70-12:2016 | Space product assurance - Design rules for printed circuit boards |
| MIL-HDBK-1861 Revision B:2013 | Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 2221 FRENCH : B2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
| IPC 2252 : 0 | DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC 6018 : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS |
| IPC 2141 : A | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| IPC M 105 : LATEST | RIGID PRINTED BOARD MANUAL |
| IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
| IPC 4103 : A | SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |
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