IPC 2222 CHINESE : A
Current
Current
The latest, up-to-date edition.
SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
Available format(s)
Hardcopy
Language(s)
Chinese
Published date
04-06-2007
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.| DocumentType |
Standard
|
| Pages |
128
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC 4411 : A | SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT |
| IPC 4103 : A | SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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