IPC 2221 GERMAN : B
Current
Current
The latest, up-to-date edition.
GENERIC STANDARD ON PRINTED BOARD DESIGN
Available format(s)
Hardcopy
Language(s)
German
Published date
20-11-2012
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.Dieses Normenwerk legt die allgemeinen Anforderungen für das Design on Leiterplatten aus organischen Materialien sowie anderen Formen der Bauteilbefestigung oder Verbindungsstrukturen fest. Die Materialien können homogen, verstärkt oder in Kombination mit anorganischen Materialien erarbeitet werden. Die Verbindungen können aus einer, zwei oder aus mehreren Lagen bestehen.
| DevelopmentNote |
German translation of B2012 Edition issued in May 2013. (11/2013) Also available in Hardcopy format. (01/2018)
|
| DocumentType |
Standard
|
| ISBN |
978-1-61193-115-0
|
| Pages |
170
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
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| IPC 4552 : 0 | PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS |
| IPC 6011 : 0 | GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS |
| IPC 4553 : A | SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
| IPC TR 001 : 1989 | AN INTRODUCTION TO TAPE AUTOMATED BONDING FINE PITCH TECHNOLOGY |
| IPC 4202 : A | FLEXIBLE BASE DIELECTRICS FOR USE IN FLEXIBLE PRINTED BOARDS |
| IPC D 356 : B | BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC 9252 : A | REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS |
| IPC 2611 : 0 | GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION |
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| IPC TM 650 : 0 | TEST METHODS MANUAL |
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| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 2615 : 0 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC 2511 : B | GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
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| IPC 7094 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS |
| IPC 1601 : 0 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| SAE AMS QQ A 250 B : 2012 | ALUMINUM AND ALUMINUM ALLOY, PLATE AND SHEET GENERAL SPECIFICATION FOR |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC 7525 : B | STENCIL DESIGN GUIDELINES |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC HDBK 840 : 0 | SOLDER MASK HANDBOOK |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 4554 : 0 | SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
| IEEE 1149.1-2013 REDLINE | IEEE Standard for Test Access Port and Boundary-Scan Architecture |
| IPC A 47 : 1996 | COMPOSITE TEST PATTERN TEN-LAYER PHOTOTOOL |
| IPC A 43 : 1995 | TEN-LAYER MULTILAYER ARTWORK |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
| IPC 4103 : A | SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS |
| IPC 2316 : 0 | DESIGN GUIDE FOR EMBEDDED PASSIVE DEVICE PRINTED BOARDS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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