IEC TR 61340-5-2:2007
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
Amended by
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
31-12-2021
Superseded by
Published date
14-08-2007
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Personnel safety
5 ESD control program
6 Automated handling equipment (AHE)
7 ESD control gloves and finger cots
8 Handtools
Annex A (informative) - Example ESD control program plan
based on IEC 61340-5-1
Annex B (informative) - ESD control element considerations
Bibliography
This technical report has been developed to support IEC 61340-5-1. The controls and limits referenced in IEC 61340-5-1 were developed to protect devices that are susceptible to discharges of 100 V or greater using the human body model test method. However, the general concepts are still valid for devices that are susceptible to discharges of less than 100 V. The main changes with respect to the previous edition are listed below: This version has been modified to provide guidance for users of IEC 61340-5-1. The text has been arranged to follow the requirements of IEC 61340-5-1 as closely as possible as well as providing specific guidance on each of the requirements of IEC 61340-5-1. The contents of the corrigendum of May 2009 have been included in this copy.
| Committee |
TC 101
|
| DevelopmentNote |
Supersedes IEC TS 61340-5-2. (08/2007) Stability Date: 2020. (04/2018)
|
| DocumentType |
Technical Report
|
| Pages |
154
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| UNE-CLC/TR 61340-5-2:2008 | Identical |
| PKN-IEC/TR 61340-5-2:2020-04 | Identical |
| VDE 0300-5-1 SUPP 1 : 2009 COR 1 2012 | Identical |
| NEN NPR IEC CLC/TR 61340-5-2 : 2008 C1 2009 | Identical |
| DIN EN 61340-5-1 SUPP 1 : 2009 COR 1 2012 | Identical |
| S.R. CLC/TR 61340-5-2:2008 | Identical |
| PD CLC/TR 61340-5-2:2008 | Identical |
| CEI 101-4 V1 : 2010 | Identical |
| CLC/TR 61340-5-2:2008 | Identical |
| PKN CLC/TR 61340-5-2 : 2014 | Identical |
| PD IEC/TR 61340-5-2:2018 | Identical |
| CEI CLC/TR 61340-5-2 : 2010 | Identical |
| 08/30180398 DC : 0 | BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
| 13/30286159 DC : 0 | BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| BS EN 60747-16-5:2013 | Semiconductor devices Microwave integrated circuits. Oscillators |
| 13/30286167 DC : 0 | BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES |
| IEC TS 62239-2:2017 | Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan |
| I.S. EN 62258-1:2010 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| IEC TR 61340-1:2012 | Electrostatics - Part 1: Electrostatic phenomena - Principles and measurements |
| BS EN 60747-16-3 : 2002 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
| EN 62435-1:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| DEFSTAN 81-146/1(2017) : 2017 | PACKAGING, STATIC SHIELDING BAGS & DISSIPATIVE MATERIALS |
| DEFSTAN 81-125/4(2015) : 2015 | ELECTROSTATIC CONDUCTIVE FOAM SHEET |
| I.S. EN 62435-2:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
| I.S. EN 61340-4-6:2015 | ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS |
| UTEC 96 029 : 2011 | ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION |
| BS EN 61340-4-7:2017 | Electrostatics Standard test methods for specific applications. Ionization |
| I.S. EN 62435-1:2017 | ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
| IEC 61340-4-7:2017 | Electrostatics - Part 4-7: Standard test methods for specific applications - Ionization |
| BS EN 60747-16-1 : 2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| ARINC 606A : 2004 | GUIDANCE FOR ELECTROSTATIC SENSITIVE DEVICE UTILIZATION AND PROTECTION |
| EN 61340-4-7:2017 | Electrostatics - Part 4-7: Standard test methods for specific applications - Ionization |
| I.S. EN 61340-4-7:2017 | ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION |
| I.S. EN 61340-5-1:2016 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS |
| IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
| VDI 2083 Blatt 17:2013-06 | Cleanroom technology - Compatibility of materials with the required cleanliness |
| BS IEC 60747-16.2 : 2001 | SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS |
| IEC 62435-4:2018 | Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage |
| DIN EN 61340-4-7 : 2018 | ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION (IEC 61340-4-7:2017) |
| 08/30190157 DC : DRAFT SEP 2008 | BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS |
| 09/30214337 DC : 0 | BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES |
| BS EN 61340-5-1:2016 | Electrostatics Protection of electronic devices from electrostatic phenomena. General requirements |
| EN 60747-16-4:2004/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017) |
| I.S. EN 60286-3:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV)) |
| I.S. EN 60747-16-3:2002 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV | Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters |
| IEC 61340-5-1:2016 RLV | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| EN 60747-16-5:2013 | Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators |
| PD IEC/TS 62239-2:2017 | Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan |
| BS EN 62435-2:2017 | Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
| 14/30267228 DC : 0 | BS EN 61340-5-1 ED 2.0 - ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS |
| DD IEC/TS 62239:2003 | Process management for avionics. Preparation of an electronic components management plan |
| 17/30355242 DC : 0 | BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES |
| BS EN 60286-3:2013 | Packaging of components for automatic handling Packaging of surface mount components on continuous tapes |
| BS EN 62258-1:2010 | Semiconductor die products Procurement and use |
| 14/30311058 DC : 0 | BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
| BS EN 61340-4-6:2015 | Electrostatics Standard test methods for specific applications. Wrist straps |
| 13/30267320 DC : 0 | BS EN 61340-4-6 ED 2.0 - ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS |
| VDE 0300-4-7 : 2018 | ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION |
| EN 60747-16-3:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017) |
| I.S. EN 60747-16-5:2013 | SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV)) |
| IEC 60747-16-2:2001+AMD1:2007 CSV | Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| 17/30365636 DC : 0 | BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| PD IEC/TS 62239-1:2015 | Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV | Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC 61340-4-6:2015 | Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| BS EN 62435-1:2017 | Electronic components. Long-term storage of electronic semiconductor devices General |
| CEI EN 60747-16-5 : 2014 | SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
| CEI EN 60747-16-3 : 2009 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
| BS EN 60747-16-4 : 2004 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
| CEI CLC/TR 62258-3 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| ISO 4586-5:2015 | High-pressure decorative laminates (HPL, HPDL) Sheets based on thermosetting resins (Usually called Laminates) Part 5: Classification and specifications for flooring grade laminates less than 2 mm thick intended for bonding to supporting substrates |
| I.S. EN 60747-16-4:2004 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| CEI EN 62258-1 : 2011 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
| EN 61340-4-6:2015 | Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
| EN 62435-2:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
| IEC TS 61340-4-2:2013 | Electrostatics - Part 4-2: Standard test methods for specific applications - Electrostatic properties of garments |
| IEC TS 60479-1:2005+AMD1:2016 CSV | Effects of current on human beings and livestock - Part 1: Generalaspects |
| IEC TR 61340-2-2:2000 | Electrostatics - Part 2-2: Measurement methods - Measurement of chargeability |
| IEC 61340-5-3:2015 | Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
| IEC 61340-4-9:2016 | Electrostatics - Part 4-9: Standard test methods for specific applications - Garments |
| IEC 61340-4-7:2017 | Electrostatics - Part 4-7: Standard test methods for specific applications - Ionization |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC 61340-2-3:2016 | Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation |
| IEC 60749-27:2006+AMD1:2012 CSV | Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
| IEC 61340-4-3:2001 | Electrostatics - Part 4-3: Standard test methods for specific applications - Footwear |
| IEC 61340-4-1:2003+AMD1:2015 CSV | Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IEC 61340-2-1:2015 | Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge |
| IEC 61340-4-5:2004 | Electrostatics - Part 4-5: Standard test methods for specific applications - Methods for characterizing the electrostatic protection of footwear and flooring in combination with a person |
| IEC 61140:2016 | Protection against electric shock - Common aspects for installation and equipment |
| IEC 61010-1:2010+AMD1:2016 CSV | Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 1: General requirements |
| IEC TR 61340-1:2012 | Electrostatics - Part 1: Electrostatic phenomena - Principles and measurements |
| IEC TS 60479-2:2007 | Effects of current on human beings and livestock - Part 2: Special aspects |
| IEC 61340-4-6:2015 | Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps |
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