IEC PAS 62326-7-1:2007

1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
5 Performance levels
6 Base materials
7 Visual inspection
   7.1 Test environment
   7.2 Test specimens
   7.3 Tools for testing
   7.4 Preparation of limit samples
   7.5 Description of inspection
8 Dimensional inspections
   8.1 Measurement of dimension
   8.2 External dimension
   8.3 Thickness
   8.4 Hole diameter
   8.5 Conductor width
   8.6 Cumulative pattern pitch
   8.7 Distance between hole centers
   8.8 Design minimum distance between board edge and
        conductor
   8.9 Position accuracy
   8.10 Registration of pressure sensitive or heatactivated
        adhesive (Including adhesive squeeze-out) to flexible
        printed board and stiffener
9 Electrical performance test
10 Mechanical performance test
11 Environmental performance
12 Chemical resistance
13 Cleanliness
14 Flame resistance
15 Marking, packaging, and storage
   15.1 Marking on products
   15.2 Marking on package
   15.3 Packaging and storage
Annex A - Handling instruction manual handling of
          polyimide-base FPC
Annex B - Ion migration test
Annex C - Whisker test
Annex D - Additional information - Explanation on JPCA
          performance guide for single-and double-sided
          flexible printed wiring boards

Provides the requirements for the single- and double-sided flexible printed wiring boards (hereinafter designated as "flexible printed board" or FPC)