IEC 62137-1-1:2007
Current
The latest, up-to-date edition.
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
11-07-2007
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
5.1 Flow soldering equipment
5.2 Reflow soldering equipment
5.3 Pull strength test equipment
5.4 Optical microscope
5.5 Test substrate
5.6 Solder alloy
5.7 Flux for flow soldering
5.8 Solder paste
6 Mounting method
6.1 Flow soldering
6.2 Reflow soldering
7 Test conditions
7.1 Test: Rapid change of temperature
7.2 Pull strength test
8 Test procedure
8.1 Test sequence
8.2 Pre-conditioning
8.3 Initial pull strength measurement
8.4 Rapid change of temperature
8.5 Recovery
8.6 Intermediate/final pull strength measurement
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) Pull strength test - Details
Bibliography
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
| Committee |
TC 91
|
| DevelopmentNote |
A Bilingual edition has been published. (05/2008) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| JIS C 62137-1-1:2010 | Identical |
| NF EN 62137-1-1 : 2014 | Identical |
| NEN EN IEC 62137-1-1 : 2007 | Identical |
| I.S. EN 62137-1-1:2007 | Identical |
| PN EN 62137-1-1 : 2008 | Identical |
| UNE-EN 62137-1-1:2007 | Identical |
| BS EN 62137-1-1:2007 | Identical |
| CEI EN 62137-1-1 : 2008 | Identical |
| EN 62137-1-1 : 2007 | Identical |
| DIN EN 62137-1-1:2008-02 | Identical |
| PNE-prEN 62137-1-1 | Identical |
| BS EN 62137-3:2012 | Electronics assembly technology Selection guidance of environmental and endurance test methods for solder joints |
| BS ISO 16525-7:2014 | Adhesives. Test methods for isotropic electrically conductive adhesives Environmental test methods |
| NF EN 62137-3 : 2012 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| ISO 16525-7:2014 | Adhesives — Test methods for isotropic electrically conductive adhesives — Part 7: Environmental test methods |
| 12/30254691 DC : DRAFT MAR 2012 | BS ISO 16525-7 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 7: ENVIRONMENTAL TEST METHODS |
| 09/30206176 DC : DRAFT JUNE 2009 | BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| IEC PAS 62137-3:2008 | Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints |
| DD IEC PAS 62137-3 : DRAFT 2008 | ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| IEC 62137-3:2011 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| CEI EN 62137-3 : 2012 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS |
| I.S. EN 62137-3:2012 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV)) |
| EN 62137-3:2012 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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