IEC 62047-18:2013
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
17-07-2013
FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method
6 Test report
Annex A (informative) - Precautions for the test
piece/substrate interface
Annex B (informative) - Precautions necessary
for the force displacement relationship
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
| Committee |
TC 47/SC 47F
|
| DevelopmentNote |
Stability date: 2017. (07/2013)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 62047-18 : 2014 | Identical |
| NBN EN 62047-18 : 2013 | Identical |
| NEN EN IEC 62047-18 : 2013 | Identical |
| PN EN 62047-18 : 2014 | Identical |
| BS EN 62047-18:2013 | Identical |
| CEI EN 62047-18 : 2014 | Identical |
| EN 62047-18:2013 | Identical |
| DIN EN 62047-18:2014-04 | Identical |
| SN EN 62047-18:2013 | Identical |
| PNE-FprEN 62047-18 | Identical |
| UNE-EN 62047-18:2013 | Identical |
| IEC 62047-6:2009 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
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