IEC 61261-1:1994
Current
Current
The latest, up-to-date edition.
Piezoelectric ceramic filters for use in electronic equipment - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
24-03-1994
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.Prescribes terms and methods of test applicable to piezoelectric ceramic filters with a high selectivity and stability intended for use in electronic equipment.
| Committee |
TC 49
|
| DevelopmentNote |
Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
51
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| SAC GB/T 17190 : 1997 | Identical |
| DD IEC/TS 61994-2:2011 | Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection. Glossary Piezoelectric and dielectric filters |
| BS EN 60368-2-2:1999 | Piezoelectric filters. Guide to the use of piezoelectric filters Piezoelectric ceramic filters |
| I.S. EN 60368-2-2:1999 | PIEZOELECTRIC FILTERS - PART 2: GUIDE TO THE USE OF PIEZOELECTRIC FILTERS - SECTION 2: PIEZOELECTRIC CERAMIC FILTERS |
| BS EN 62047-7:2011 | Semiconductor devices. Micro-electromechanical devices MEMS BAW filter and duplexer for radio frequency control and selection |
| IEC TS 61994-2:2011 | Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection - Glossary - Part 2: Piezoelectric and dielectric filters |
| IEC 61261-2:1994 | Piezoelectric ceramic filters for use in electronic equipment - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 2: Sectional specification - Qualification approval |
| I.S. EN 62047-7:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS BAW FILTER AND DUPLEXER FOR RADIO FREQUENCY CONTROL AND SELECTION |
| 09/30200793 DC : 0 | BS EN 61994-2 ED.2 - PIEZOELECTRIC AND DIELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - GLOSSARY - PART 2: PIEZOELECTRIC AND DIELECTRIC FILTERS |
| IEC 62047-7:2011 | Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection |
| 08/30172394 DC : DRAFT APR 2008 | BS EN 62047-7 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS FBAR FILTER & DUPLEXER |
| CEI EN 62047-7 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS BAW FILTER AND DUPLEXER FOR RADIO FREQUENCY CONTROL AND SELECTION |
| IEC 61261-2-1:1994 | Piezoelectric ceramic filters for use in electronic equipment - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 2: Sectional specification - Qualification approval - Section 1: Blank detail specification - Assessment level E |
| EN 60368-2-2:1999 | Piezoelectric filters - Part 2: Guide to the use of piezoelectric filters - Section 2: Piezoelectric ceramic filters |
| EN 62047-7 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS BAW FILTER AND DUPLEXER FOR RADIO FREQUENCY CONTROL AND SELECTION |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IEC 60368-1:2000+AMD1:2004 CSV | Piezoelectric filters of assessed quality - Part 1: Genericspecification |
| IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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