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IEC 61249-2-7:2002

Current

Current

The latest, up-to-date edition.

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

05-03-2002

$273.25
Including GST where applicable

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
   3.1 Insulating base
   3.2 Metal foil
   3.3 Reinforcement
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
   6.1 Appearance of the copper-clad sheet
   6.2 Appearance of the unclad face
   6.3 Laminate thickness
   6.4 Bow and twist
   6.5 Properties related to the copper foil bond.
   6.6 Punching and machining
   6.7 Dimensional stability
   6.8 Sheet sizes
   6.9 Cut panels
7 Non-electrical properties of the base material after
   removal of the copper foil
   7.1 Appearance of the dielectric base material
   7.2 Flexural strength
   7.3 Flammability
   7.4 Water absorption
   7.5 Measling
   7.6 Glass transition temperature and cure factor
8 Quality assurance
   8.1 Quality system
   8.2 Responsibility for inspection
   8.3 Qualification inspection
   8.4 Quality conformance inspection
   8.5 Certificate of conformance
   8.6 Safety data sheet
9 Packaging and marking
10 Ordering information
Annex A (informative) Engineering information
Annex B (informative) Common laminate constructions
Annex C (informative) Guideline for qualification and
        conformance inspection

Gives requirements for properties of epoxide woven E-glass laminated sheet 0,05 mm up to 3,2 mm, of defined flammability, copper-clad.

Committee
TC 91
DevelopmentNote
Supersedes IEC 60249-2-5, IEC 60249-2-12. (06/2004) Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
41
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

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CEI EN 62137-1-4 : 2010 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
I.S. EN 62137-1-5:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
BS IEC 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
BS ISO 16525-7:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Environmental test methods
12/30274796 DC : 0 BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX
14/30309692 DC : 0 BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS
02/211157 DC : DRAFT DEC 2002 IEC 61249-4-12 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
NF EN 60127-7 : 2013 MINIATURE FUSES - PART 7: MINIATURE FUSE-LINKS FOR SPECIAL APPLICATIONS
10/30215969 DC : 0 BS EN 60127-7 - MINIATURE FUSES - PART 7: MINIATURE FUSE-LINKS FOR SPECIAL APPLICATIONS
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BS EN 60539-1:2016 Directly heated negative temperature coefficient thermistors Generic specification
NF EN 60384-1 : 2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 60384-1:2016 Fixed capacitors for use in electronic equipment Generic specification
IEC 60571:2012 Railway applications - Electronic equipment used on rolling stock
BS EN 61051-1:2008 Varistors for use in electronic equipment Generic specification
ISO 16525-7:2014 Adhesives — Test methods for isotropic electrically conductive adhesives — Part 7: Environmental test methods
CEI EN 60068-2-21 : 2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
OVE/ONORM EN 61051-1 : 2009 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN 60738-1:2006 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
CEI EN 50155 : 2008 RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
CEI EN 61249-4-11 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 62137-1-4:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
CEI EN 61249-4-12 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
IEC 60127-2:2014 Miniature fuses - Part 2: Cartridge fuse-links
IEC 62326-1:2002 Printed boards - Part 1: Generic specification
BS EN 50155:2017 Railway applications. Rolling stock. Electronic equipment
16/30282633 DC : 0 BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
EN 62326-1:2002 Printed boards - Part 1: Generic specification
IEC 60384-1:2016 RLV Fixed capacitors for use in electronic equipment - Part 1: Generic specification
EN 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
EN 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
EN 61249-4-15 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
EN 61051-1:2008 Varistors for use in electronic equipment - Part 1: Generic specification
EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
EN 60738-1:2006/A1:2009 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
EN 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
I.S. EN 61051-1:2008 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
12/30254691 DC : DRAFT MAR 2012 BS ISO 16525-7 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 7: ENVIRONMENTAL TEST METHODS
BS EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
06/30157868 DC : 0 BS EN 60393-1 - POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 61249-4-16 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
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BS EN 60738-1 : 2006 THERMISTORS - DIRECTLY HEATED POSITIVE TEMPERATURE COEFFICIENT - PART 1: GENERIC SPECIFICATION
09/30206176 DC : DRAFT JUNE 2009 BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies
CEI EN 62137-1-5 : 2010 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
BS IEC 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
12/30254697 DC : 0 BS ISO 16525-9 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS
11/30243259 DC : 0 BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
12/30242499 DC : DRAFT MAR 2012 BS ISO 16525-2 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 2: DETERMINATION OF ELECTRICAL CHARACTERISTICS
BS EN 62137-1-1:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Pull strength test
NF EN 62137-1-5 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-5: MECHANICAL SHEAR FATIGUE TEST
BS ISO 16525-9:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Determination of high-speed signal-transmission characteristics
BS EN 62137-1-5:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joints Mechanical shear fatigue test
BS EN 62024-1:2008 High frequency inductive components. Electrical characteristics and measuring methods Nanohenry range chip inductor
12/30274800 DC : 0 BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE
BS EN 60127-3:2015 Miniature fuses Sub-miniature fuse-links
CEI EN 60393-1 : 2010 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
NF EN 60352-8 : 2011 SOLDERLESS CONNECTIONS - PART 8: COMPRESSION MOUNT CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
IEC 62024-1:2017 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
I.S. EN IEC 62024-1:2018 HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
EN IEC 62024-1:2018 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 61249-4-14 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-12:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
I.S. EN 62137-1-2:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
IEC 60539-1:2016 Directly heated negative temperature coefficient thermistors - Part 1: Generic specification
I.S. EN 61249-4-1:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
IEC PAS 62137-3:2008 Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 61249-4-14:2009 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
13/30287806 DC : 0 BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
BS EN 60352-8:2011 Solderless connections Compression mount connections. General requirements, test methods and practical guidance
02/211156 DC : DRAFT DEC 2002 IEC 61249-4-11 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
DD IEC PAS 62137-3 : DRAFT 2008 ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
I.S. EN 61249-4-15:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
14/30312344 DC : 0 PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
BS EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
BS EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
07/30164961 DC : 0 BS EN 61249-4-15 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS EN 62137-1-2:2007 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Shear strength test
BS EN 62326-4:1997 Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
14/30301133 DC : 0 BS EN 60127-7:2014 - MINIATURE FUSES - PART 7: MINIATURE FUSE-LINKS FOR SPECIAL APPLICATIONS
10/30235541 DC : 0 BS EN 61249-4-19 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
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BS EN 60127-7:2016 Miniature fuses Miniature fuse-links for special applications
07/30160635 DC : 0 BS EN 60352-8 - SOLDERLESS CONNECTIONS - PART 8: COMPRESSION MOUNT CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
BS ISO 16525-2:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Determination of electrical characteristics for use in electronic assemblies
CEI EN 60352-8 : 2012 SOLDERLESS CONNECTIONS - PART 8: COMPRESSION MOUNT CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
16/30338234 DC : 0 BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
BS EN 62326-1:2002 Printed boards Generic specification
I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
I.S. EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
NF EN 61249-4-1 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
I.S. EN 60393-1:2009 POTENTIOMETERS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
IEC 60393-1:2008 Potentiometers for use in electronic equipment - Part 1: Generic specification
IEC 61051-1:2007 Varistors for use in electronic equipment - Part 1: Generic specification
I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
BS EN ISO 9455-17:2006 Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues
EN 50155:2017 Railway applications - Rolling stock - Electronic equipment
EN 60127-3:2015 Miniature fuses - Part 3: Sub-miniature fuse-links
10/30235537 DC : 0 BS EN 61249-4-18 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPEG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPEG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
07/30149142 DC : 0 BS IEC 60115-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
NF EN 61051-1 : 2013 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
12/30274804 DC : 0 BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE
14/30280850 DC : 0 BS EN 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
I.S. EN 61249-4-16:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
CEI EN 61249-4-15 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
11/30247723 DC : 0 BS IEC 60571 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
BS EN 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
BS EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
BS ISO 9455-17 : 2002 AMD 16425 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
BS PD ISO/IEC PAS 60127-8 : 2014 MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
CEI EN 61051-1 : 2010 VARISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
12/30254694 DC : DRAFT MAR 2012 BS ISO 16525-8 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 8: ELECTROCHEMICAL-MIGRATION TEST METHODS
BS EN 62137-1-4:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
06/30149145 DC : DRAFT OCT 2006 IEC 60384-1 - FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
NF EN 62137-1-4 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
NF EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
NF EN 50155 : 2007 RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
I.S. EN 61189-5-4:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
CEI EN 62137-1-1 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
I.S. EN 61249-4-17:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
EN 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
I.S. EN 60127-3:2015 MINIATURE FUSES - PART 3: SUB-MINIATURE FUSE-LINKS
I.S. EN 60127-2:2014 MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS
I.S. EN 62137-1-3:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
EN 60539-1:2016/AC:2017-09 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017)
EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
IEC 60738-1:2006+AMD1:2009 CSV Thermistors - Directly heated positive temperature coefficient -Part 1: Generic specification
IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
ISO 16525-9:2014 Adhesives — Test methods for isotropic electrically conductive adhesives — Part 9: Determination of high-speed signal-transmission characteristics
IEC 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
ISO 9455-17:2002 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
IEC 60352-8:2011 Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance
IEC 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
IEC 60127-3:2015 Miniature fuses - Part 3: Sub-miniature fuse-links
IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
IEC 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
EN 62137-1-1 : 2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
EN ISO 9455-17:2006 Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
02/211159 DC : DRAFT DEC 2002 IEC 61249-4-2 ED.1 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)
I.S. EN 60127-7:2016 MINIATURE FUSES - PART 7: MINIATURE FUSE-LINKS FOR SPECIAL APPLICATIONS
BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
BS EN 61249-4-15:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
I.S. EN 62137-4:2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
BS EN 60393-1:2009 Potentiometers for use in electronic equipment Generic specification
CEI EN 61249-4-1 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
BS EN 61249-4-14:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
I.S. EN 61249-4-11:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
CEI EN 62137-1-2 : 2008 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-2: SHEAR STRENGTH TEST
CEI EN 62137-3 : 2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
07/30164957 DC : 0 BS EN 61249-4-14 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
IEEE C62.33-1982 IEEE Standard Test Specifications for Varistor Surge-Protective Devices
BS ISO 16525-8:2014 Adhesives. Test methods for isotropic electrically conductive adhesives Electrochemical-migration test methods
BS IEC 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
07/30164969 DC : 0 EN 61249-4-17 - MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
I.S. EN 61249-4-14:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
BS EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
CEI EN 60539-1 : 2009 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
I.S. EN 62137-1-1:2007 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST
I.S. EN 62137-3:2012 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
I.S. EN 61189-5-3:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
I.S. EN 62024-1:2008 HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR
I.S. EN 61189-5-2:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
BS EN 60068-2-21:2006 Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
I.S. EN 60068-2-21:2006 ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
NF EN 60127-4 : 2005 AMD 2 2013 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
I.S. EN 60352-8:2011 SOLDERLESS CONNECTIONS - PART 8: COMPRESSION MOUNT CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
ISO 16525-8:2014 Adhesives — Test methods for isotropic electrically conductive adhesives — Part 8: Electrochemical-migration test methods
ISO 16525-2:2014 Adhesives — Test methods for isotropic electrically conductive adhesives — Part 2: Determination of electrical characteristics for use in electronic assemblies
I.S. EN 62326-1:2002 PRINTED BOARDS - GENERIC SPECIFICATION
I.S. EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
IEC 60127-7:2015 Miniature fuses - Part 7: Miniature fuse-links for special applications
IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
IEC 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
EN 60127-7:2016 Miniature fuses - Part 7: Miniature fuse-links for special applications
EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
EN 60127-2:2014 Miniature fuses - Part 2: Cartridge fuse-links
EN 60352-8:2011 Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance
EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)
EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
EN 60393-1:2009 Potentiometers for use in electronic equipment - Part 1: Generic specification
EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
EN 61249-4-14 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
CSA E60384.1 : 2014 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
I.S. EN ISO 9455-17:2006 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES
ONORM EN ISO 9455-17 : 2006 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES

ISO 11014-1:1994 Safety data sheet for chemical products Part 1: Content and order of sections
IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
ISO 14001:2015 Environmental management systems — Requirements with guidance for use
ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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