IEC 61192-3:2002
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Hardcopy , PDF 1 User
31-12-2021
English - French
17-12-2002
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Inspection techniques
4.4 Interpretation of requirements
5 Component preparation processes
5.1 Lead forming
5.2 Lead protrusion and clinching
5.3 Lead cutting/cropping
5.4 Pre-tinning
6 Masking attributes
6.1 Misalignment
6.2 Improper adhesion
6.3 Thermal capability
7 Insertion of through-hole components
7.1 General requirements
7.2 Orientation and mounting criteria
7.3 Missing component
7.4 Wrong component
7.5 Damaged component
8 Soldering process attributes
8.1 General requirements
8.2 Misalignment
8.3 Damaged components
8.4 Solder joint characteristics
9 Cleaning attributes
9.1 Flux residues
9.2 Other residues
10 Rework/replacement attributes
Figures
Tables
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
| DevelopmentNote |
To be used in conjunction with IEC 61192-1, IEC 61192-2 and IEC 61192-4. (12/2002) Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
93
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NF EN 61192-3 : 2003 | Identical |
| BS EN 61192-3:2003 | Identical |
| GOST R IEC 61192-3 : 2010 | Identical |
| CEI EN 61192-3 : 2003 | Identical |
| EN 61192-3:2003 | Identical |
| DIN EN 61192-3:2003-10 | Identical |
| NEN EN IEC 61192-3 : 2003 | Identical |
| PN EN 61192-3 : 2007 | Identical |
| SN EN 61192-3 : 2003 | Identical |
| I.S. EN 61192-3:2003 | Identical |
| UNE-EN 61192-3:2003 | Identical |
| IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| BS EN 60115-2:2015 | Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
| EN 60115-2:2015 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| IEC 60115-2:2014 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
| BS EN 60717:2012 | Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
| BS EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies Terminal assemblies |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| BS EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies Surface-mount assemblies |
| BS EN 60068-2-82:2007 | Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components |
| BS EN 61193-1:2002 | Quality assessment systems Registration and analysis of defects on printed board assemblies |
| BS EN 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| BS 6221-25:2000 | Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies |
| 97/206324 DC : DRAFT MAY 1997 | |
| 97/230541 DC : DRAFT AUG 1997 | |
| NF EN 60068-2-82 : 2013 | ENVIRONMENTAL TESTING - PART 2-82 : TESTS - TEST XW1 : WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS |
| EN 61193-1:2002 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| EN 61192-5 : 2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| EN 60717:2012 | Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| IEC 60717:2012 | Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
| EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| EN 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components |
| EN 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| I.S. EN 61192-4:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES |
| I.S. EN 61192-2:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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