IEC 61191-3:2017
Current
Current
The latest, up-to-date edition.
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French, English
Published date
30-05-2017
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Through-hole mounting of components
6 Acceptance requirements
7 Rework of unsatisfactory solder connections
Annex A (normative) - Placement requirements for
through-hole mount devices
Bibliography
IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2024. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
40
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN EN IEC 61191-3 : 2017 | Identical |
| PN EN 61191-3 : 2017 | Identical |
| UNE-EN 61191-3:2017 | Identical |
| BS EN 61191-3:2017 | Identical |
| EN 61191-3:2017 | Identical |
| JIS C 61191-3:2020 | Identical |
| PNE-prEN 61191-3:2016 | Identical |
| DIN EN 61191-3:2016-01 (Draft) | Identical |
| GOST R IEC 61191-3 : 2010 | Identical |
| I.S. EN 61191-3:2017 | Identical |
| BS EN 50377-8-5:2007 | Identical |
| NF EN 61191-3 : 2000 | Identical |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| BS EN 61190-1-1:2002 | Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| I.S. EN 61192-3:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
| I.S. EN 61193-1:2002 | QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| I.S. EN 61192-2:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| BS CECC 200025:1998 | Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities |
| 05/30133283 DC : DRAFT MAY 2005 | IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| CEI CECC 200025 : 2000 | PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES |
| 97/206324 DC : DRAFT MAY 1997 | |
| OVE/ONORM EN 60068-2-20 : 2009 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| BS EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies |
| BS EN 60068-2-20:2008 | Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads |
| I.S. EN 60068-2-20:2008 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| 97/230541 DC : DRAFT AUG 1997 | |
| IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| BS EN 61193-1:2002 | Quality assessment systems Registration and analysis of defects on printed board assemblies |
| CECC 200025 : 1998 | PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| BS EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies Surface-mount assemblies |
| 12/30258438 DC : 0 | BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| 05/30138801 DC : DRAFT SEP 2005 | IEC 60068-2-20 ED 5 - BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2-20: TEST - TEST T - TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF LEADED DEVICES |
| CEI EN 60068-2-20 : 2009 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
| I.S. EN 61190-1-1:2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 61193-1:2002 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| EN 61192-5 : 2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61193-3:2013 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| IEC 61188-5-3:2007 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC PAS 62326-7-1:2007 | Performance guide for single- and double-sided flexible printed wiring boards |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IEC 61188-7:2017 | Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-6:2003 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61188-5-5:2007 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
| ISO 9001:2015 | Quality management systems — Requirements |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| IPC OI 645 : 0 | STANDARD FOR VISUAL OPTICAL INSPECTION AIDS |
| IEC 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC SM 817 : A | GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| IPC 9191 : 0 | GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) |
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