IEC 60748-2:1997
Current
The latest, up-to-date edition.
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
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English - French
22-12-1997
Contents
Foreword
Clause
Chapter I: General
1. Scope
2. Normative references
Chapter II: Terminology and Letter Symbols
1. Terminology for combinatorial and sequential
integrated circuits
2. Examples
3. Terminology for integrated circuit memories
4. Terminology for integrated circuit microprocessors
5. Terminology for charge-transfer devices
6. Letter symbols for combinatorial and sequential
circuits
7. Letter symbols for the dynamic parameters of
sequential integrated circuits, including memories
8. Additional terms and definitions for digital integrated
circuits
9. Classification of programmable logic devices (PLDs)
Chapter III: Essential Ratings and Characteristics
Section One - Digital Integrated Circuits, General
1. Circuit identification and description
2. Functional specifications
3. Ratings (limiting values)
4. Recommended operating conditions (within the specified
operating temperature range)
5. Static electrical characteristics for bipolar integrated
circuits
6. Static and quasi-static electrical characteristics for
MOS integrated circuits
7. Dynamic electrical characteristics
8. Total power or currents provided from the supplies
9. Total current drawn from the power supplies (dynamic
operation)
10. Command pulse information (where appropriate)
11. Insulation resistance
12. Mechanical ratings, characteristics and other data
13. Supplementary information
14. Handling precautions
Appendix to Section One - Specification of characteristics
Section Two - Integrated Circuit Memories
A. Static and dynamic read/write memories and read/only
memories
1. Circuit identification and description
2. Functional specifications
3. Ratings (limiting values)
4. Recommended operating conditions (within the specified
operating temperature range)
5. Static electrical characteristics for bipolar memories
6. Static electrical characteristics for MOS memories
7. Dynamic electrical characteristics
8. Power or current drawn from each supply (static
operation)
9. Power or current drawn from each supply (dynamic
operation)
10. Mechanical ratings, characteristics and other data
11. Supplementary information
12. Handling precautions
B. Field-programmable read-only memories
1. Circuit identification and description
2. Functional specifications
3. Ratings (limiting values)
4. Read mode
5. Programming mode
6. Erasing mode (if applicable)
7. Number of programming-erasing cycles
8. Data retention information
9. Power or current drawn from each supply (static
operation)
10. Power or current drawn from each supply (dynamic
operation)
11. Mechanical ratings, characteristics and other data
12. Supplementary information
13. Handling precautions
C. Content addressable memories (CAM)
1. Circuit identification and description
2. Functional specifications
3. The provisions of clauses 3 to 6 of Section Two A apply
4. The provisions of clauses 7 and 7.1 of Section Two A
apply with the exception of 7.1.1 which is replaced by
the following
5. The provisions of 7.2 and 7.3 of Section Two A apply
6. The provisions of clauses 8 to 12 of Section Two A apply
Section Three - Integrated Circuit Microprocessors
1. Circuit identification and description
2. Functional specifications
3. Ratings (limiting values)
4. Recommended operating conditions (within the specified
operating temperature range)
5. Electrical characteristics
6. Mechanical ratings, characteristics and other data
7. Supplementary information
8. Handling precautions
Section Four - Programmable Logic Devices (PLDs)
1. Circuit identification and types
2. Application related description
3. Specification of the function
4. Limiting values (absolute maximum rating system)
5. Recommended operating conditions (within the specified
operating temperature range)
6. Electrical characteristics
7. Programming
8. Design aspects
9. Mechanical and environment rating, characteristics and
data
10. Additional information
Chapter IV: Measuring Methods
Section One - General
1. Basic requirements
2. Specific requirements
3. Application matrix for the measuring methods
Section Two - Measuring Methods of static Characteristics
1. High-level and low-level output voltages (VOH and VOL)
37
2. High-level and low-level input currents (/IH and /IL)
38
3. Short-circuit output current (/OS) 40
4. Power supply current under static conditions 41
5. (Input) threshold voltages and hysteresis voltage 48
6. Input clamping voltage (VIK) 94
7. Off-state output current (/OZ) 95
8. Latch-up characteristics 96
Section Three - Dynamic Measurements
1. Total current drawn from the power supplies under
dynamic conditions
2. Power supplied through the clock line 2
3. Input and output impedances 6, 11
4. Times characterizing the circuit
5. Switching frequency of a sequential circuit 10
6. Method of verification of the function of a digital
integrated circuit 97
Chapter V: Acceptance and Reliability
Section One - Electrical Endurance Tests
1. General requirements
2. Specific requirements
Table 7
This publication gives standards for the following categories or sub-categories of devices: -Combinatorial and sequential digital circuits; -Integrated circuit memories; -Integrated circuit microprocessors; -Charge-transfer devices. Should be used together with IEC 60747-1 and 60748-1.
Committee |
TC 47/SC 47A
|
DevelopmentNote |
Supersedes IEC 60186B and IEC 60748-2L. (07/2004) Stability Date: 2020. (09/2017)
|
DocumentType |
Standard
|
Pages |
347
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
IS 12970 : Part 2 : 2021 | Identical |
SAC GB/T 17574 : 1998 | Identical |
BS IEC 60748-2:1997 | Identical |
NEN IEC 60748-2 : 1998 | Identical |
PN IEC 60748-2 : 2002 | Identical |
DIN IEC 60748-2:1990-11 | Identical |
08/30180398 DC : 0 | BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS |
BS EN 190100:1993 | Harmonized system of quality assessment for electronic components: sectional specification: digital monolithic integrated circuits |
15/30325282 DC : 0 | BS EN 62884-1 - MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELETIRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
BS EN 60747-16-3 : 2002 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
I.S. EN 60679-1:2017 | PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS IEC 60748-2.20 : 2008 | SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 2-20: DIGITAL INTEGRATED CIRCUITS - FAMILY SPECIFICATION - LOW VOLTAGE INTEGRATED CIRCUITS |
06/30153491 DC : DRAFT JULY 2006 | EN 60748-2-20 - SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 2-20: DIGITAL INTEGRATED CIRCUITS - FAMILY SPECIFICATION - LOW VOLTAGE INTEGRATED CIRCUITS |
BS EN 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators Basic methods for the measurement |
BS IEC 60748-5:1997 | Semiconductor devices. Integrated circuits Semicustom integrated circuits |
14/30282293 DC : 0 | BS EN 60679-1 - PIEZOELECTRIC AND ASSOCIATED MATERIAL OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
EN 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
CEI EN 60679-1 : 2009 | PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
BS EN 60747-16-1 : 2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
IEC 60748-2-20:2008 | Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits |
I.S. EN 60747-16-1:2002 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
IEC 60748-2-12:2001 | Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs) |
BS QC 760200:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
BS QC 760100:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures |
BS CECC 90300:1988 | Harmonized system of quality assessment for electronic components. Sectional specification: interface monolithic integrated circuits |
BS IEC 60747-16.2 : 2001 | SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS |
BS QC 790109:1992 | Specification for harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits.Family specification for HCMOS digital integrated circuits series 54/74 HC, 54/74 HCT, 54/74 HCU |
BS EN 60679-1:2017 | Piezoelectric, dielectric and electrostatic oscillators of assessed quality Generic specification |
BS IEC 60748-11:2000 | Semiconductor devices. Integrated circuits Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
BS IEC 60748-2.12 : 2001 | SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - DIGITAL INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR PROGRAMMABLE LOGIC DEVICES (PLDS) |
BS QC790100(1991) : 1991 AMD 10586 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - SEMICONDUCTOR DEVICES - SECTIONAL SPECIFICATION FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS |
I.S. EN 60747-16-3:2002 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
I.S. EN 62884-1:2017 | MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT |
IEC 60748-11:1990 | Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
IEC 62884-1:2017 | Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement |
IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
IEC 60679-1:2017 | Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification |
IEC 60748-4:1997 | Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits |
CEI EN 60747-16-1 : 2009 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS |
EN 60679-1:2017 | Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification |
IEC 60747-16-2:2001+AMD1:2007 CSV | Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers |
IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV | Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters |
IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV | Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches |
IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV | Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers |
DIN EN 190000:1996-05 | GENERIC SPECIFICATION - MONOLITHIC INTEGRATED CIRCUITS |
EN 60747-16-3:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017) |
CEI EN 60747-16-3 : 2009 | SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS |
BS EN 60747-16-4 : 2004 | SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES |
EN 60747-16-1:2002/A2:2017 | SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS (IEC 60747-16-1:2001/A2:2017) |
BS CECC90100(1987) : AMD 7845 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: DIGITAL MONOLITHIC INTEGRATED CIRCUITS |
IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
IEC 60748-3:1986 | Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits |
IEC 60748-4:1997 | Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits |
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