IEC 60603-12:1992
Current
The latest, up-to-date edition.
Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
25-06-1992
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FOREWORD
Clause
1 Scope
2 Normative references
3 IEC type designation
4 Common features
5 Dimensions
6 Characteristics
7 Test schedule
8 Dual-in-line sockets with solder termination for
through-board insertion (standard type)
9 Dual-in-line sockets with solderless wire wrapping
terminations for through-board insertion (standard
type)
10 Dual-in-line sockets with solder terminations for
through-board insertion (low-profile type)
11 Dual-in-line sockets with solderless wire wrapping
terminations for through-board insertion (low-profile
type)
12 Individual contact retention force gauge
13 Socket gauges
Covers dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits in dual-in-line format. Sockets include standard type and low-profile type.
| Committee |
TC 48/SC 48B
|
| DevelopmentNote |
Also numbered as BS EN 60603-12. (11/2005) Stability Date: 2020. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
46
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60603-12 : 1998 | Identical |
| NEN EN IEC 60603-12 : 1998 | Identical |
| PN EN 60603-12 : 2002 | Identical |
| SN EN 60603-12 : 1998 | Identical |
| UNE-EN 60603-12:1998 | Identical |
| CEI EN 60603-12 : 2001 | Identical |
| EN 60603-12:1998 | Identical |
| DIN EN 60603-12:1998-07 | Identical |
| DIN IEC 60603-12:1994-08 | Identical |
| PNE-EN 60603-12 | Identical |
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| EN IEC 62148-1:2018 | Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance |
| IEC 62148-1:2017 | Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance |
| IEC 60512-6:1984 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests |
| IEC 60512-7:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests |
| IEC 60097:1991 | Grid systems for printed circuits |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| ISO 468:1982 | Surface roughness — Parameters, their values and general rules for specifying requirements |
| IEC 60512-4:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests |
| IEC 60512-5:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests |
| IEC 60512-3:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests |
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