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IEC 60512-16-7:2008

Current

Current

The latest, up-to-date edition.

Connectors for electronic equipment - Tests and measurements - Part 16-7: Mechanical tests on contacts and terminations - Test 16g: Measurement of contact deformation after crimping

Available format(s)

Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

21-07-2008

$37.69
Including GST where applicable

FOREWORD
1 Scope and object
2 Normative references
3 Preparations
4 Test procedure
5 Measurements and requirements
6 Details to be specified
Bibliography

IEC 60512-16-7:2008 details a standard test method to assess the effectiveness of contacts to resist deformation (damage) from crimping operations.

Committee
TC 48/SC 48B
DevelopmentNote
To be read in conjunction with IEC 60512-1 and IEC 60512-1-100. (07/2008) Supersedes IEC 60512-8. (05/2012) Stability Date: 2017. (10/2012)
DocumentType
Standard
Pages
13
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

IEC 60512-1-1:2002 Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination
IEC 60352-2:2006+AMD1:2013 CSV Solderless connections - Part 2: Crimped connections - Generalrequirements, test methods and practical guidance

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