IEC 60512-11-5:2002
Current
The latest, up-to-date edition.
Connectors for electronic equipment - Tests and measurements - Part 11-5: Climatic tests - Test 11e: Mould growth
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French, Spanish, Castilian
21-02-2002
Foreword
1 General
2 Preparation
3 Test method
4 Details to be specified
Defines a standard test method to assess the extent and the effect of mould growth on the functioning of a component (essentially a connector) submitted to a mould culture.
| Committee |
TC 48/SC 48B
|
| DevelopmentNote |
Stability Date: 2017. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
7
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60512-11-5 : 2002 | Identical |
| NEN EN IEC 60512-11-5 : 2002 | Identical |
| I.S. EN 60512-11-5:2002 | Identical |
| PN EN 60512-11-5 : 2002 | Identical |
| BS EN 60512-11-5:2002 | Identical |
| CEI EN 60512-11-5 : 2003 | Identical |
| EN 60512-11-5:2002 | Identical |
| UNE-EN 60512-11-5:2002 | Identical |
| JIS C 5402-11-5:2005 | Identical |
| DIN EN 60512-11-5:2003-01 | Identical |
| 03/100395 DC : DRAFT APR 2003 | EN 175101-809 - DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY |
| EN 175101-809:2004/corrigendum Jun. 2005 | DETAIL SPECIFICATION: TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2,54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75 101-801, WITH ASSESSED QUALITY |
| BS EN 175101-809:2004 | Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75 101-801, with assessed quality |
| I.S. EN 175101-809:2004 | DETAIL SPECIFICATION - TWO-PART CONNECTORS FOR PRINTED BOARDS HAVING A GRID OF 2.54 MM, SHORT VERSION IN COMPLIANCE WITH CECC 75101-801, WITH ASSESSED QUALITY |
| ISO/IEC 24739-3:2010 | Information technology — AT Attachment with Packet Interface - 7 — Part 3: Serial transport protocols and physical interconnect (ATA/ATAPI-7 V3) |
| IEC 60512-3-1:2002 | Connectors for electronic equipment - Tests and measurements - Part 3-1: Insulation tests - Test 3a: Insulation resistance |
| IEC 60512-1-1:2002 | Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination |
| IEC 60068-2-10:2005 | Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth |
| EN 60512-3-1:2002 | Connectors for electronic equipment - Tests and measurements - Part 3-1: Insulation tests - Test 3a: Insulation resistance |
| HD 323.2.10 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST J AND GUIDANCE: MOULD GROWTH |
| EN 60512-1-1:2002 | Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination |
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