IEC 60384-10:1989

FOREWORD
PREFACE
SECTION ONE - GENERAL
Clause
1 General
  1.1 Scope
  1.2 Object
  1.3 Related documents
  1.4 Information to be given in a detail specification
  1.5 Terminology
  1.6 Marking
SECTION TWO - PREFERRED RATINGS AND CHARACTERISTICS
2 Preferred ratings and characteristics
  2.1 Preferred characteristics
  2.2 Preferred values of ratings
SECTION THREE - QUALITY ASSESSMENT PROCEDURES
3 Quality assessment procedures
  3.1 Primary Stage of Manufacture
  3.2 Structurally Similar Components
  3.3 Certified Records of Released Lots
  3.4 Qualification Approval
  3.5 Quality Conformance Inspection
SECTION FOUR - TEST AND MEASUREMENT PROCEDURES
4 Test and measurement procedures
  4.1 Special preconditioning
  4.2 Preliminary drying
  4.3 Measuring conditions
  4.4 Mounting
  4.5 Visual examination and check of dimensions
  4.6 Electrical tests
  4.7 Variation of capacitance with temperature
  4.8 Adhesion
  4.9 Bond strength of the end face plating
  4.10 Resistance to soldering heat
  4.11 Solderability
  4.12 Rapid change of temperature
  4.13 Climatic sequence
  4.14 Damp heat, steady state
  4.15 Endurance
  4.16 Robustness of terminations (Only for capacitors
       with strip terminations)
  4.17 Component solvent resistance
  4.18 Solvent resistance of the marking
Appendix A - Guide for the specification and coding of
             selecting dimensions of multilayer ceramic
             chip capacitors
Appendix B - Capacitance ageing of fixed capacitors of
             ceramic dielectric, Class 2

Applicable to fixed unencapsulated multilayer chip capacitors ofceramic dielectric, Class 1 and Class 2, with a rated voltagenormally not exceeding 200 V, for use in electronic equipment. Thesecapacitors have metallized connecting pads or soldering strips andare intended to be mounted directly on to substrates for hybridcircuits or on to printed boards.