IEC 60368-1:2000+AMD1:2004 CSV
Current
Current
The latest, up-to-date edition.
Piezoelectric filters of assessed quality - Part 1: Genericspecification
Amended by
Available format(s)
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
28-05-2013
Publisher
Important note : All end users must be registered with an Account prior to user licenses being assigned.IEC 60268-1:2000+A1:2004 Specifies the methods of test and general requirements for piezoelectric filters of assessed quality using either capability approval or qualification approval procedures. This consolidated version consists of the fourth edition (2000) and its amendment 1 (2004). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 49
|
| DevelopmentNote |
BS DRAFT 98/231211 REFERS TO DRAFT AND POSSIBLE NEW BS Also numbered as BS EN 60368-1. (10/2001) Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
73
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60368-1 : 2000 AMD 1 2006 | Identical |
| NEN EN IEC 60368-1 : 2000 AMD 1 2004 | Identical |
| I.S. EN 60368-1:2000 | Identical |
| PN EN 60368-1 : 2002 AMD 1 2005 | Identical |
| SN EN 60368-1 : 2000 | Identical |
| EN 60368-1:2000/A1:2004 | Identical |
| DIN EN 60368-1:2005-04 | Identical |
| DIN IEC 60368-1:1993-02 | Identical |
| NEN 10368-1 : 1984 | Identical |
| BS 9600:1983 | Similar to |
| 02/206181 DC : DRAFT MAY 2002 | IEC 61019-1. ED.1 - SURFACE ACOUSTIC WAVE RESONATORS (SAW) OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
| BS EN 60368-3:2010 | Piezoelectric filters of assessed quality Standard outlines and lead connections |
| DD IEC/TS 61994-2:2011 | Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection. Glossary Piezoelectric and dielectric filters |
| CEI EN 60368-4 : 2003 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 4: SECTIONAL SPECIFICATION - CAPABILITY APPROVAL |
| I.S. EN 61837-3:2015 | SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 3: METAL ENCLOSURES |
| CEI EN 60368-3 : 2011 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 3: STANDARD OUTLINES AND LEAD CONNECTIONS |
| BS EN 60368-2-2:1999 | Piezoelectric filters. Guide to the use of piezoelectric filters Piezoelectric ceramic filters |
| I.S. EN 60368-3:2010 | PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 3: STANDARD OUTLINES AND LEAD CONNECTIONS |
| EN 61837-2:2011/A1:2014 | SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES (IEC 61837-2:2011/A1:2014) |
| EN 61837-3:2015 | Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures |
| EN 60368-3:2010 | Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections |
| 09/30198254 DC : 0 | BS EN 60368-3 ED.4 - PIEZOELECTRIC FILTERS OF ASSESSED QUALITY - PART 3: STANDARD OUTLINES AND LEAD CONNECTIONS |
| BS EN 62047-7:2011 | Semiconductor devices. Micro-electromechanical devices MEMS BAW filter and duplexer for radio frequency control and selection |
| IEC TS 61994-2:2011 | Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection - Glossary - Part 2: Piezoelectric and dielectric filters |
| IEC 61837-3:2015 | Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures |
| IEC 61261-1:1994 | Piezoelectric ceramic filters for use in electronic equipment - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval |
| BS EN 60368-4:2001 | Piezoelectric filters Sectional specification. Capability approval |
| 13/30278807 DC : 0 | BS EN 61837-3 - SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTI0N - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 3: METAL ENCLOSURE |
| IEC 61261-2:1994 | Piezoelectric ceramic filters for use in electronic equipment - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 2: Sectional specification - Qualification approval |
| BS EN 167000:1993 | Harmonized system of quality assessment for electronic components. Generic specification: piezoelectric filters |
| I.S. EN 62047-7:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS BAW FILTER AND DUPLEXER FOR RADIO FREQUENCY CONTROL AND SELECTION |
| I.S. EN 61837-2:2011 | SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES |
| 09/30200793 DC : 0 | BS EN 61994-2 ED.2 - PIEZOELECTRIC AND DIELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - GLOSSARY - PART 2: PIEZOELECTRIC AND DIELECTRIC FILTERS |
| BS EN 61837-3:2015 | Surface mounted piezoelectric devices for frequency control and selection. Standard outlines and terminal lead connections Metal enclosures |
| IEC 60368-4-1:2000 | Piezoelectric filters of assessed quality - Part 4-1: Blank detail specification - Capability approval |
| IEC 62047-7:2011 | Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection |
| 09/30200395 DC : 0 | BS EN 61837-2 ED. 2 - SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES |
| 08/30172394 DC : DRAFT APR 2008 | BS EN 62047-7 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS FBAR FILTER & DUPLEXER |
| BS EN 60368-4-1:2001 | Piezoelectric filters. Blank detail specification. Capability approval |
| CEI EN 62047-7 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS BAW FILTER AND DUPLEXER FOR RADIO FREQUENCY CONTROL AND SELECTION |
| I.S. EN 60368-2-2:1999 | PIEZOELECTRIC FILTERS - PART 2: GUIDE TO THE USE OF PIEZOELECTRIC FILTERS - SECTION 2: PIEZOELECTRIC CERAMIC FILTERS |
| BS EN 61837-2 : 2011 | SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION - STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS - PART 2: CERAMIC ENCLOSURES |
| IEC 61019-1-2:1993 | Surface acoustic wave (SAW) resonators - Part 1: General information, standard values and test conditions - Section 2: Test conditions |
| IEC 60368-4:2000 | Piezoelectric filters of assessed quality - Part 4 : Sectional specification - Capability approval |
| IEC 60368-3:2010 | Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections |
| EN 60368-2-2:1999 | Piezoelectric filters - Part 2: Guide to the use of piezoelectric filters - Section 2: Piezoelectric ceramic filters |
| EN 62047-7 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 7: MEMS BAW FILTER AND DUPLEXER FOR RADIO FREQUENCY CONTROL AND SELECTION |
| EN 60368-4-1:2000 | Piezoelectric filters of assessed quality - Part 4-1: Blank detail specification - Capability approval |
| EN 60368-4:2000 | Piezoelectric filters of assessed quality - Part 4: Sectional specification - Capability approval |
| IEC 60368-4:2000 | Piezoelectric filters of assessed quality - Part 4 : Sectional specification - Capability approval |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| IECQ 001002-2:1998 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 2: DOCUMENTATION |
| IEC 60068-2-64:2008 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
| IECQ 001004:2006 | |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC GUIDE 102:1996 | Electronic components - Specification structures for quality assessment (Qualification approval and capability approval) |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| IEC 60068-2-10:2005 | Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 61000-4-2:2008 | Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques - Electrostatic discharge immunity test |
| IECQ 001002-1:1998 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 1: ADMINISTRATION |
| IEC 60050-561:2014 | International Electrotechnical Vocabulary (IEV) - Part 561: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 61178-1:1993 | Quartz crystal units - A specification in the IEC Quality Assessment System for Electronic Components (IECQ) - Part 1: Generic specification |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60068-2-52:2017 | Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution) |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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