IEC 60326-9:1991
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English - French
19-03-1991
Important note : All end users must be registered with an Account prior to user licenses being assigned.
FOREWORD
PREFACE
Clause
1. Scope
2. Normative references
3. General
4. Test specimens
5. Relevant specification
6. Characteristics of printed boards
7. Test pattern - Test boards
Figures
Relates to flexible multilayer printed boards with through connections irrespective of their method of manufacture. Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods to be used, and establishes uniform requirements for judging properties and dimensions.Not applicable to flat cables.
| DevelopmentNote |
Also numbered as BS 6221-9(1991) (09/2005)
|
| DocumentType |
Standard
|
| Pages |
63
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| DIN IEC 60326-9:1993-04 | Identical |
| SAC GB/T 18334 : 2001 | Identical |
| NEN 10326-9 : 1991 | Identical |
| IEC 60326-12:1992 | Printed boards - Part 12: Specification for mass lamination panels (semi-manufactured multilayer printed boards) |
| BS EN 123800:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 123800:1996 | Sectional Specification: Flexible multilayer printed boards with through connections |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
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