IEC 60191-1:2018
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
Hardcopy , PDF 1 User , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, English - French
23-01-2018
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General rules for all drawings
5 Additional rules
6 Inter-conversion of inch and millimetre dimensions and
rules for rounding off
7 Rules for coding
Annex A (informative) - Reference letter symbols
Annex B (informative) - Rules to specify the dimensions and
positions of terminals on a base drawing
Annex C (normative) - General philosophy of flat base devices
Annex D (normative) - Special rules for SMD-packages
Annex E (informative) - Examples of semiconductor device drawings
Annex F (informative) - Former rules for rounding off
Annex G (informative) - Former rules for coding
Bibliography
IEC 60191-1:2018 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
b) a definition of the term "stand-off" has been added;
c) the methods for locating the datum have been extended to be suitable for SMD-packages;
d) the visual identification of terminal position one for automatic handling has been clarified;
e) the rules for the drawing of terminals have been clarified;
f) Table A.1 has been completed with symbols specifically for SMD-packages;
g) Annex B "Standardization philosophy" has been deleted;
h) a normative Annex with special rules for SMD-packages has been added;
i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Supersedes IEC 60191-1A, IEC 60191-1B and IEC 60191-1C. (04/2007) Stability Date: 2023. (01/2018)
|
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN-EN-IEC 60191-1:2018 | Identical |
| CEI EN IEC 60191-1 : 2018 | Identical |
| SS-EN IEC 60191-1:2018 | Identical |
| EN IEC 60191-1:2018 | Identical |
| IS 5001:2018 | Identical |
| UNE-EN IEC 60191-1:2018 | Identical |
| BS EN IEC 60191-1:2018 | Identical |
| OVE EN IEC 60191-1: 2018 11 01 | Identical |
| IEC 60191-6-3:2000 | Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) |
| IEC 60191-6-1:2001 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals |
| ISO 5459:2011 | Geometrical product specifications (GPS) — Geometrical tolerancing — Datums and datum systems |
| IEC 60191-6-21:2010 | Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| ISO 261:1998 | ISO general purpose metric screw threads — General plan |
| ISO 370:1975 | Toleranced dimensions — Conversion from inches into millimetres and vice versa |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| ISO 263:1973 | ISO inch screw threads — General plan and selection for screws, bolts and nuts — Diameter range 0,06 to 6 in |
| IEC 60191-6-20:2010 | Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) |
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