I.S. EN 62258-6:2006
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
Hardcopy , PDF
English
01-01-2006
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Requirements for information for thermal simulation
5.1 Requirements for bare die with or without added connection
structures
5.2 Requirements for minimally-packaged die
5.3 Information on thermal simulation model
Annex ZA (normative) Normative references to international
Publications with their corresponding European
publications
Bibliography
Ascertains the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die.
| DevelopmentNote |
Supersedes I.S. ES 59008-4-3. (11/2006) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62258-6:2006 | Identical |
| NBN EN 62258-6 : 2007 | Identical |
| EN 62258-6 : 2006 | Identical |
| DIN EN 62258-6:2007-02 | Identical |
| NF EN 62258-6 : 2006 | Identical |
| BS EN 62258-6:2006 | Identical |
| EN 62258-2:2011 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
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