EN 62047-1:2016
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
08-04-2016
FOREWORD
1 Scope
2 Terms and definitions
Annex A (informative) - Standpoint and criteria in editing
this glossary
Annex B (informative) - Clause cross-references of
IEC 62047-1:2005 and IEC 62047-1:2015
Bibliography
IEC 62047-1:2016 defines terms for micro-electromechanical devices including the process of production of such devices.This edition includes the following significant technical changes with respect to the previous edition:a) removal of ten terms;b) revision of twelve terms;c) addition of sixteen new terms.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN 62047-1 : 2016 | Identical |
| I.S. EN 62047-1:2016 | Identical |
| NF EN 62047-1 : 2016 | Identical |
| UNE-EN 62047-1:2016 | Identical |
| DIN EN 62047-1:2014-05 (Draft) | Identical |
| PN EN 62047-1 : 2016 | Identical |
| SN EN 62047-1:2016 | Identical |
| BS EN 62047-1:2016 | Identical |
| IEC 62047-1:2016 | Identical |
| NEN EN IEC 62047-1 : 2016 | Identical |
| CEI EN 62047-1 : 2016 | Identical |
| PNE-FprEN 62047-1 | Identical |
| BS EN 62047-25:2016 | Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area |
| I.S. EN 62047-4:2010 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
| CEI EN 60876-1 : 2015 | FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
| I.S. EN 62047-14:2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS (IEC 62047-14:2012 (EQV)) |
| BS EN 60876-1:2014 | Fibre optic interconnecting devices and passive components. Fibre optic spatial switches Generic specification |
| BS EN 62047-14:2012 | Semiconductor devices. Micro-electromechanical devices Forming limit measuring method of metallic film materials |
| I.S. EN 62047-25:2016 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
| CEI EN 62047-14 : 2013 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS |
| BS EN 62047-4:2010 | Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS |
| EN 62047-14:2012 | Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials |
| EN 62047-4:2010 | Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS |
| CEI EN 62047-4 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 4: GENERIC SPECIFICATION FOR MEMS |
| CEI EN 62047-25 : 1ED 2017 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA |
| I.S. EN 60876-1:2014 | FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - FIBRE OPTIC SPATIAL SWITCHES - PART 1: GENERIC SPECIFICATION |
| EN 60876-1:2014 | Fibre optic interconnecting devices and passive components - Fibre optic spatial switches - Part 1: Generic specification |
| IEC 60050-815:2015 | International Electrotechnical Vocabulary (IEV) - Part 815: Superconductivity |
| ISO 2041:2009 | Mechanical vibration, shock and condition monitoring Vocabulary |
| IEC 60050-521:2002 | International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
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