EN 61249-5-4:1996
Current
The latest, up-to-date edition.
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
09-08-1996
Foreword
1 Scope
2 Normative references
3 Requirements
3.1 Storage properties
3.2 Containers and their markings
3.3 Electrical properties
3.4 Non-electrical properties
Annexes
A Test pattern for insulation resistance measurement
B Conversion table
C Bibliography
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Details requirements for the qualification of conductive inks, and for conductive inks intended for use as a substitute for metallic finishes on contacts.
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| CEI EN 61249-5-4 : 1997 | Identical |
| DIN EN 61249-5-4:1997-02 | Identical |
| I.S. EN 61249-5-4:1999 | Identical |
| NF EN 61249 5-4 : 1997 | Identical |
| SN EN 61249-5-4 : 1996 | Identical |
| BS EN 61249-5-4:1997 | Identical |
| IEC 61249-5-4:1996 | Identical |
| UNE-EN 61249-5-4:1997 | Identical |
| PN EN 61249-5-4 : 2002 | Identical |
| NBN EN 61249 5-4 : 1997 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| HD 323.2.3 : 200S2 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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