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EN 61249-2-27:2013

Current

Current

The latest, up-to-date edition.

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Published date

22-03-2013

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IEC 61249-2-27:2012 gives requirements for properties of bismaleimide/triazine modified with non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of polymeric structure or in addition to it. The glass transition temperature is defined to be 160 °C minimum.

Committee
CLC/SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

EN 61249-5-1:1996 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
ISO 14001:2015 Environmental management systems — Requirements with guidance for use
ISO 11014:2009 Safety data sheet for chemical products — Content and order of sections
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IEC PAS 61249-6-3:2011 Specification for finished fabric woven from "E" glass for printed boards
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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