EN 60749-22:2003
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
20-06-2003
FOREWORD
INTRODUCTION
1 Scope and object
2 Methods A and B (see also annex A)
3 Method C
4 Method D
5 Methods E and F
6 Method G: Wire ball shear test
7 Information to be given in the relevant specification
Annex A (normative) - Guidance
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60749-22 : 2003 | Identical |
| IEC 60749-22:2002 | Identical |
| NBN EN 60749-22 : 2004 | Identical |
| NEN EN IEC 60749-22 : 2003 | Identical |
| I.S. EN 60749-22:2003 | Identical |
| PN EN 60749-22 : 2006 | Identical |
| BS EN 60749-22:2003 | Identical |
| CEI EN 60749-22 : 2004 | Identical |
| DIN EN 60749-22:2003-12 | Identical |
| UNE-EN 60749-22:2004 | Identical |
| BS EN 62317-9:2006 | Identical |
| EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
| BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
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