EN 60286-5:2004/A1:2009
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS
11-03-2009
15-06-2018
1 Scope
2 Material
3 Mechanical stability
4 Tray design, dimensions and other physical properties
5 Polarity and orientation of components in the tray
6 Tray stacking
7 Missing components
8 Marking
Annex A (informative) - List of existing matrix trays with
wide anticipated use in the electronic
industries
Annex B (normative) - Measurement methodology of the tray
dimensions
Specifies the common dimensions, tolerances and characteristics of tray.
| Committee |
SR 40
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| DIN EN 60286-5:2009-09 | Identical |
| CEI EN 60286-5 : 2009 | Identical |
| BS EN 60286-5 : 2004 | Identical |
| NBN EN 60286-5 : 2005 AMD 1 2009 | Identical |
| I.S. EN 60286-5:2004 | Identical |
| PN EN 60286-5 : 2005 AMD 1 2009 | Identical |
| NEN EN IEC 60286-5 : 2004 AMD 1 2009 | Identical |
| NF EN 60286-5 : 2005 AMD 1 2014 | Identical |
| SN EN 60286-5 : 1997 | Identical |
| IEC 60286-5:2003+AMD1:2009 CSV | Identical |
| UNE-EN 60286-5:2005 | Identical |
| BS EN 60286-5:2004+A1:2009 | Identical |
| I.S. EN 61188-5-2:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
| BS EN 61760-2:2007 | Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide |
| CEI EN 61760-2 : 2008 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| CEI EN 61760-1 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| BS EN 61188-5-4:2007 | Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides |
| I.S. EN 61188-5-4:2007 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES |
| I.S. EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
| OVE/ONORM EN 61760-1 : 2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
| BS EN 61760-1:2006 | Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
| BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
| EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| OVE/ONORM EN 61760-2 : 2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
| I.S. EN 61760-2:2007 | SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE |
| BS EN 61188-5-2:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components |
| EN 61188-5-4:2007 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
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