EN 60191-6-2:2002
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
15-02-2002
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm
pitch
5 Column terminal packages, 1,50 mm, 1,27 mm and
1,00 mm pitch
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| UNE-EN 60191-6-2:2003 | Identical |
| NBN EN 60191 6-2 : 2002 | Identical |
| I.S. EN 60191-6-2:2002 | Identical |
| NEN EN IEC 60191-6-2 : 2002 | Identical |
| CEI EN 60191-6-2 : 2002 | Identical |
| PN EN 60191-6-2 : 2003 | Identical |
| NF EN 60191-6-2 : 2002 | Identical |
| DIN EN 60191-6-2:2002-09 | Identical |
| IEC 60191-6-2:2001 | Identical |
| BS EN 60191-6-2:2002 | Identical |
| BS EN 60191-6-18:2010 | Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA) |
| EN 60191-6-18:2010 | Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) |
| EN 62137:2004/corrigendum:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| BS EN 60191-6-19:2010 | Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage |
| BS EN 62137:2004 | Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN |
| CEI EN 60191-6-19 : 2011 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE |
| I.S. EN 62137:2005 | ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN |
| BS EN 62137-4:2014 | Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
| I.S. EN 62137-4:2014 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
| I.S. EN 60191-6-19:2010 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE |
| EN 60191-6-19:2010 | Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage |
| EN 62137-4:2014/AC:2015 | ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
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