DSCC 85136 : E
Current
Current
The latest, up-to-date edition.
HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, FIN STOCK, ALUMINIUM ALLOY
Published date
23-02-2010
Publisher
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies the requirements for a family of aluminum alloy fin stock heat sinks for use with electronic components.
| Committee |
FSC 5999
|
| DocumentType |
Standard
|
| PublisherName |
Defense Supply Centre Columbus
|
| Status |
Current
|
| MIL-H-87111 Revision A:1984 | HEAT SINKS, SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| ASME B46.1 : 2009 | SURFACE TEXTURE (SURFACE ROUGHNESS, WAVINESS, AND LAY) |
| ANSI/NCSL Z540 1 : 94(R2002) | CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS |
| MIL-DTL-19491 Revision J:2014 | SEMICONDUCTOR DEVICES, PACKAGING OF |
| ASTM B 209 : 2014 : REDLINE | Standard Specification for Aluminum and Aluminum-Alloy Sheet and Plate |
| MIL-STD-202 Revision H:2015 | ELECTRONIC AND ELECTRICAL COMPONENT PARTS |
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