DIN EN 60749-20-1:2009-10
Current
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Available format(s)
Hardcopy , PDF
Language(s)
German
Published date
01-01-2009
Important note : All end users must be registered with an Account prior to user licenses being assigned.Dieser Teil der DIN EN 60749 gilt für alle oberflächenmontierbaren Bauelemente (SMD) mit nicht hermetisch dichten Gehäusen, welche in einem Reflow-Lötverfahren beansprucht werden und die der Umgebungsatmosphäre ausgesetzt werden.
| DevelopmentNote |
Supersedes DIN IEC 60749-20-1. (10/2009)
|
| DocumentType |
Standard
|
| Pages |
39
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 60749-20-1:2009 | Identical |
| EN 60749-20-1 : 2009 | Identical |
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